Experimental Study on Thermal Performance of Low Power SMD LEDs Light Bars: Thermal Resistance Modeling

  • Malika OuhadouEmail author
  • Aumeur El Amrani
  • Said Ziani
  • Choukri Messaoudi
Conference paper
Part of the Lecture Notes in Intelligent Transportation and Infrastructure book series (LNITI)


Thermal management of light sources based on Light Emitting Diodes technology is a fundamental issue that can significantly affect the performance and life time of installed lighting products. By conducting an experimental study, this paper focuses on the vital role of passive cooling method in thermal management of low-power SMD LEDs Light bars. The used approach in this work aims to give an appropriate model to evaluate the thermal resistance of the heat sink. In order to optimize the cooling performance of a heat sink, it is recommended to minimise its thermal resistance as same as improve its cooling capacity since the thermal resistance impact the total resistance of LED package. In addition, the experimental measurements associated to the LEDs’ illuminances and temperature distribution are made using advanced equipment such as digital luxmeter, and IR camera, respectively, which the results are analyzed by Raycam reporting System software in real time.


SMD LEDs light bar Thermal resistance Fins heat sink IR camera 



The authors gratefully acknowledge the National Center for Scientific and Technical Research (NCSTR) for the financial support offered from their program of excellence research grants (2016 Edition).


  1. 1.
    Hsu, Huan-Chu, Huang, Yi-Cheng: Numerical simulation and experimental validation for the thermal analysis of a compact LED recessed downlight with heat sink design. Appl. Sci. 7(4), 1–17 (2017)Google Scholar
  2. 2.
    Raypah, M.E., Devarajan, D.M.K.M., Sulaiman, F.: Investigation on thermal characterization of low power SMD LED mounted on different substrate packages. Appl. Therm. Eng. 101, 19–29 (2016)CrossRefGoogle Scholar
  3. 3.
    Ha, M., Graham, S.: Development of a thermal resistance model for chip-on-board packaging of high power LED arrays. Microelectron. Reliab. 52(5), 836–844 (2012)CrossRefGoogle Scholar
  4. 4.
    Ye, H., Mihailovic, M., Wong, C.K.Y., et al.: Two-phase cooling of light emitting diode for higher light output and increased efficiency. Appl. Therm. Eng. 52(2), 353–359 (2013)CrossRefGoogle Scholar
  5. 5.
    Zhou, J., Huang, J., Wang, Y., Zhou, Z.: Thermal distribution of multiple LED module. Appl. Therm. Eng. 93, 122–130 (2016)CrossRefGoogle Scholar
  6. 6.
    Raypah, M.E., Devarajan, M., Sulaiman, F.: Influence of injection current and ambient temperature in intensity and wavelength of low-power SMD LED. In: Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference, 2016 IEEE 37th International. pp. 1–6 (2016)Google Scholar
  7. 7.
    Tsai, M.-Y., Tang, C.-Y., Zheng, C.-E., Tsai, Y.-Y., Chen, C.-H.: Thermal analyses of LED light bars and backlight modules. J. Mech. 33(03), 331–339 (2017)CrossRefGoogle Scholar
  8. 8.
    Sheu, G.-J., Hwu, F.-S., Tu,S.-H., et al.: The heat dissipation performance of LED applied a MHP. In: Fifth International Conference on Solid State Lighting. International Society for Optics and Photonics, p. 594113. (Sep 2005)Google Scholar
  9. 9.
    Jang, D., Yu, S.-H., Lee, K.-S.: Multidisciplinary optimization of a pin-fin radial heat sink for LED lighting applications. Int. J. Heat Mass Transf. 55, 515–521 (2012)CrossRefGoogle Scholar
  10. 10.
    Xiao, C., Liao, H., Wang, Y., et al.: A novel automated heat-pipe cooling device for high-power LEDs. Appl. Therm. Eng. 111, 1320–1329 (2017)CrossRefGoogle Scholar
  11. 11.
    Tsai, M.Y., Chen, C.H., Kang, C.S.: Thermal measurements and analyses of low-cost high-power LED packages and their modules. Microelectron. Reliab. 52(5), 845–854 (2012)CrossRefGoogle Scholar
  12. 12.
    Cheng, H.H., Huang, D.-S., Lin, M.-T.: Heat dissipation design and analysis of high power LED array using the finite element method. Microelectron. Reliab. 52(5), 905–911 (2012)CrossRefGoogle Scholar
  13. 13.
    Sergent, J.E, Krum, A.: Thermal Management Handbook: for Electronic Assemblies. McGraw-Hill Professional (1998)Google Scholar
  14. 14.
  15. 15.
    SMD LED datasheet:, last accessed 2018/06/08
  16. 16.
    Thomas, A., Nair, A.S.: Experimental study on the effect of junction temperature on power LED’S. Int. J. Curr. Eng. Sci. Res. 2(9), 14–19 (2015)Google Scholar

Copyright information

© Springer Nature Switzerland AG 2019

Authors and Affiliations

  • Malika Ouhadou
    • 1
    Email author
  • Aumeur El Amrani
    • 1
    • 2
  • Said Ziani
    • 3
  • Choukri Messaoudi
    • 1
  1. 1.OTEA, Department of Physics, FSTUniversity My IsmailErrachidiaMorocco
  2. 2.EPSMS, Department of Physics, FSTUniversity My IsmailErrachidiaMorocco
  3. 3.ESSN, ENSET Mohammed V University in RabatRabatMorocco

Personalised recommendations