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Circuits for Electronic-Photonic Integration

  • Horst ZimmermannEmail author
Chapter
Part of the Springer Series in Advanced Microelectronics book series (MICROELECTR., volume 13)

Abstract

In this chapter newest research on three-dimensional integration is described. Three promising methods for 3D integration of using copper micro pillars, interwafer connects, and through-silicon vias are introduced. The application of these 3D-integration techniques in the integration of photonic chips on top of electronic chips is described subsequently. Four application examples, a multi-node optical switch, a transceiver, a sensor for optical tomography, and a sensor for 3D microimaging are explained in detail from system architecture down to the transistor level.

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Copyright information

© Springer Nature Switzerland AG 2018

Authors and Affiliations

  1. 1.EMCETechnische Universität WienViennaAustria

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