Copper Electrodepositon

Chapter
First Online:
Part of the Nanostructure Science and Technology book series (NST)

Abstract

Copper sulfate (CuSO4·5H2O) and sulfuric acid (H2SO4) are the primary constituents of the Acid copper sulfate bath [1]. The formulation of the bath is adjusted depending on the intended use, as given in Table 1.1.

Keywords

Copper Deposition Copper Surface Copper Sulfate Exchange Current Density Sulfuric Acid Concentration 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.
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References

  1. 1.
    Dini JW, snyder DD (2010) Electrodeposition of copper in modern electroplating. In: Schlesinger M, Paunovic M (ed) Wiley, NewYorkGoogle Scholar
  2. 2.
    Wagner C (1951) Theoretical analysis of the current density distribution in electrolytic cells. J Electrochem Soc 98:116–128CrossRefGoogle Scholar
  3. 3.
    Conway BE, Bockris J.O’M, Linton Ü (1956) Proton conductance and the existence of the H3 ion. J Chem Phys 24:834–850Google Scholar
  4. 4.
    Seiter H, Fischer H, Albert L (1960) Elektrochemish-morphologische studien zur erforschung des mechanismus der elektrokristallisation, fern vom anfangszustand. Electrochim Acta 2:97–120CrossRefGoogle Scholar
  5. 5.
    Mattsson E, O’ J, Bockris M (1959) Galvanostatic studies of the kinetics of deposition and dissolution in the copper + copper sulfate system. Trans Faraday Soc 55:1586–1601CrossRefGoogle Scholar
  6. 6.
    O’ J, Bockris M, Enyo M (1962) Mechanism of electrodeposition and dissolution processes of copper in aqueous solutions. Trans Faraday Soc 58:1187–1202CrossRefGoogle Scholar
  7. 7.
    Molodov AI, Markosyan GN, Losev VV (1972) Regularities of low-valency inter mediate accumulation during a step-wise electrode process. Electrochim Acta 17:701–721CrossRefGoogle Scholar
  8. 8.
    Molodov AI, Yanov LA, Markosyan GN, Losev VV (1977) Surface effects during cathodic copper deposition from methanolic and aqeous solutions. Extend abstracts of I.S.E meeting, Vazna 69:313Google Scholar
  9. 9.
    Peters D, Cruser S (1965) Cathodic chronopotentiometry of copper (I) and copper (II) in chloride media. J Electroanal Chem 9:27–40Google Scholar
  10. 10.
    Wan CC (1974) A study of electrochemical kinetics of copper deposition under pulsed current conditions. Columbia University, DissertationGoogle Scholar
  11. 11.
    Burrows IR, Harrison JA, Thompson J (1975) The deposition of copper. Electroanal Chem 58:241–249CrossRefGoogle Scholar
  12. 12.
    Harrison JA, Sandbah DR, Stronach PJ (1979) The rate of deposition of copper, Zinc and Cadmium. Electrochim Acta 24:179–189CrossRefGoogle Scholar
  13. 13.
    Burrows IR, Dick KL, Harrison JA (1976) A comparison of the rate of copper deposition at mercury copper amalgam and copper metal. Electrochim Acta 21:81–84CrossRefGoogle Scholar
  14. 14.
    Glarum SH, Marshall JH (1981) An admittance study of the copper electrode. J Electrochem Soc 128:968–979CrossRefGoogle Scholar
  15. 15.
    Tindall GW, Bruckenstein S (1968) A ring-disk electrode study of the deposition and stripping of thin copper films at platinum in sulfuric acid. Anal Chem 40:1637–1640CrossRefGoogle Scholar
  16. 16.
    Tindall GW, Bruckenstein S (1968) A ring-disk electrode study of the electrochemical reduction of copper (II) in 0.2 M sulfuric acid on platinum. Anal Chem 40:1051–1054CrossRefGoogle Scholar
  17. 17.
    Tindall GW, Bruckenstein S (1968) Determination of heterogeneous equilibrium constants by chemical stripping at a ring disk electrode. Anal Chem 40:1402–1404CrossRefGoogle Scholar
  18. 18.
    Yokoi M, Konishi S, Hayashi T (1983) Mechanism of the electrodeposition and dissolution of copper in an acid copper sulfate bath. Denki Kagaku 51:310–315Google Scholar
  19. 19.
    Jenkins LH, Bertocci U (1965) On the equilibrium properties of single crystalline copper electrodes. J Electrochem Soc 112(5):517–520CrossRefGoogle Scholar
  20. 20.
    Itagaki M, Yamamoto H, Watanabe K (2000) Disproportional reaction of copper in chloride solution investigated by channel flow double. Zairyo-to-Kankyo (in Japanese) 49:546–552Google Scholar
  21. 21.
    Lamb VA (1969) Electroplating with current pulses in the microsecond range. Plating 56:909–913Google Scholar
  22. 22.
    Cheh HY, Linford HB, Wan CC (1977) A pplication of pulsed plating techniques to metal deposition—2 pulsed plating of copper. Plating 64:66–67Google Scholar
  23. 23.
    Hayashi T, Yokoi M (1979) The role of intermediate (Cu +) in the electrodeposition of copper from an acid copper sulfate bath under pulsed current electrolysis. Denki Kagaku 47(11):654–658Google Scholar
  24. 24.
    Tantavichet N, Pritzker MD (2003) Low- and high-frequency pulse current and pulse reverse plating of copper. J Electrochem Soc 150:C665–C677CrossRefGoogle Scholar
  25. 25.
    Trasatti S (1992) Electrified interfaces in physics, chemistry and biology. In Guidelli R (ed) Kluwer Academic Publishers, Dordrecht, p 245Google Scholar
  26. 26.
    Ehlers CB, Villegas I, Stickeny JL (1990) The surface chemistry of Cu (100) in HCl solutions as a function of potential: a study by LEED, Auger spectroscopy and depth profiling. J Electroanal Chem 284:403–412CrossRefGoogle Scholar
  27. 27.
    Vogt MR, Lachenwitzer A, Magnussen OM, Behm RJ (1998) In-situ STM study of the initial stages of corrosion of Cu (100) electrodes in sulfuric and hydrochloric acid solution. Surf Sci 399:49–69CrossRefGoogle Scholar
  28. 28.
    Moffat TP, Ou Yang LY (2010) Accelerator surface phase associated with super conformal Cu electrodeposition. J Electrochem Soc 157(4):D228–D241CrossRefGoogle Scholar
  29. 29.
    Li WH, Wang Y, Ye JH, Li SFY (2001) In situ STM study of chloride adsorption on Cu (110) electrode in hydrochloric acid aqueous solution. J Phys Chem B 105:1829–1833CrossRefGoogle Scholar
  30. 30.
    Nagy Z, Blaudeau JP, Hung NC, Curtiss LA, Zurawski DJ (1995) Chloride ion catalysis of the copper deposition reaction. J Electrochem Soc 142(6):L87–L89Google Scholar
  31. 31.
    Itagaki M, Tagaki M, Watanabe K (1996) Study of dissolution mechanism of copper in perchloric acid solution containing NaCl by channel flow double electrode and electrochemical quartz crystal microbalance. Corros Sci 38:1109–1125CrossRefGoogle Scholar
  32. 32.
    Lee HP, Nobe K (1986) Kinetics and mechanisms of Cu electrodissolution in chloride media. J Electrochem Soc 133:2035–2043Google Scholar
  33. 33.
    Pangarov NA (1965) Preferred orientations in electro-deposited metals. J Electroanal Chem 9:70–85Google Scholar
  34. 34.
    Itoh S, Yamazoe N, Seiyama T (1977) Electrocrystalization of various metals onto copper single crystal substrates. Surf Techn 5:27–42CrossRefGoogle Scholar
  35. 35.
    Damjanovic A, Setty TC, Bockris JO’M (1966) Effect of crystal plane on the mechanism and the kinetics of copper electrocrystallization. J Electrochem Soc 113:429–440Google Scholar
  36. 36.
    Okada G, Yamazoe N, Seiyama T (1976) Polarization measurement of copper deposition on copper single crystal electrodes by the galvanostatic double pulse method, Denki Kagaku (in Japanese) 44:413–417Google Scholar
  37. 37.
    Wilson KS, Rogers JA (1996). Tec Proc Amer Electroplaters Soc 51:92–95Google Scholar
  38. 38.
    Yokoi M, Konishi S, Hayashi T (1983) Effect of Cl− ions on the crystallization process in acid copper sulfate baths. Denki Kagaku 51:416Google Scholar
  39. 39.
    74th CRC Handbook of Chemistry and Physics (1992) Solubility product constants. CRC Press Inc., Boca Raton 8–49Google Scholar
  40. 40.
    Soares DM, Wasle S, Weil KG, Doblhofer K (2002) Copper ion reduction catalyzed by chloride ions. J Electroanal Chem 532:353–358CrossRefGoogle Scholar
  41. 41.
    Yokoi M, Konishi S, Hayashi T (1983) Mechanism of the electrodeposition and dissolution of copper in an acid copper sulfate bath IV. Acceleration mechanism in the presence of Cl− ions, Denki Kagaku 51(6):460–464Google Scholar

Copyright information

© Springer Science+Business Media New York 2014

Authors and Affiliations

  1. 1.Osaka Prefecture UniversityOsakaJapan

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