Two-Phase Microgap Channel Cooling Technology for Hotspots Mitigation

Chapter
Part of the SpringerBriefs in Applied Sciences and Technology book series (BRIEFSAPPLSCIENCES)

Abstract

Hotspots can be generated by non-uniform heat flux condition over the heated surface due to higher packaging densities and greater power consumption of high-performance computing technology in military systems designs. Because of this hotspot within a given chip, local heat generation rate exceed the average value on the chip and increase the peak temperature for a given total power generation which degrades the reliability and performance of equipments. This chapter presents the comparison of hotspot mitigation ability of microgap heat sink with conventional straight microchannel heat sink at the beginning of the chapter. The comparison is done with the same footprint, the same inlet mass flux, and the same effective and wall heat flux supplied based on the footprint. In the later section, this chapter presents the influencing factors of hotspots and its mitigation in microgap heat sink.

Keywords

Microgap channel Microchannel Flow boiling Hotspots mitigation 

Reference

  1. 1.
    Koo J, Jiang L, Bari A, Zhang L, Wang E, Kenny TW, Santiago JG, Goodson KE (2002) Convective boiling in microchannel heat sinks with spatially-varying heat generation. Thermal and Thermomechanical Phenomena in Electronic Systems (2002), ITherm, pp 341–346Google Scholar

Copyright information

© The Author(s) 2014

Authors and Affiliations

  1. 1.Department of Mechanical EngineeringNational University of SingaporeSingaporeSingapore
  2. 2.Department of Building Environment and Energy ApplicationsXi’an Jiaotong UniversityXi’anPeople’s Republic of China

Personalised recommendations