High Temperature Polymers For Electronic Devices

  • J. Economy
Chapter

Synopsis

In this paper, the potential advantages of polymers as dielectric insulating layers in advanced microelectronic devices are described along with the requirements for their use in chips. Some of the key results obtained from a detailed study of polyimides carried out within IBM are summarized along with efforts aimed at optimizing the polyamic acid precursor to achieve improved processibility. Finally, some preliminary results of work on a new type of high temperature polymer are described that appears to satisfy many of the shortcomings of existing systems.

Keywords

Metal Line Polymeric Insulator Pyromellitic Dianhydride Polyamic Acid Aromatic Unit 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.
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Copyright information

© Plenum Press, New York 1984

Authors and Affiliations

  • J. Economy
    • 1
  1. 1.IBM Research LaboratorySan JoseUSA

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