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Fracture in Piezoelectric Ceramics and PZT/Electrode Interfaces

  • H. Jelitto
  • F. Feiten
  • G. A. Schneider
  • C. Häusler
  • H. Balke
Conference paper

Abstract

The fracture behavior of piezoelectric ceramic (PZT) as well as metal/PZT interfaces under mechanical and electric loading is examined in four and three point bending under conditions of controlled crack growth (see Fig. 1). The experiments are performed in a custom made very stiff testing machine. A special modulation technique, i.e. a small signal compliance method, allows in situ determination of the mechanical compliance Cm, the capacitance Ce, and the piezoelectric compliance Cp as a function of the crack length. By calculating the derivatives of these generalized compliances with respect to the crack surface area we get the total linear energy release rate.

Keywords

Stress Intensity Factor External Electric Field Piezoelectric Ceramic Stable Crack Growth Mechanical Compliance 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

References

  1. 1.
    Suo, Z., ASME 1991, AD-vol. 24/AMD-vol. 123, 1–6Google Scholar
  2. 2.
    Heyer, V., Schneider, G.A., Balke, H., Drescher, J., and Bahr, H.-A., Acta Mater., vol. 46(18), 6615–6622, 1998CrossRefGoogle Scholar
  3. 3.
    Jelitto, H., Feiten, F., Swain M.V., and Schneider G.A., J. Appl. Mech., submittedGoogle Scholar

Copyright information

© Springer 2007

Authors and Affiliations

  • H. Jelitto
    • 1
  • F. Feiten
    • 1
  • G. A. Schneider
    • 1
  • C. Häusler
    • 2
  • H. Balke
    • 2
  1. 1.Hamburg University of Technology, Institute of Advanced CeramicsHamburgGermany
  2. 2.Technische Universität Dresden, Institut für FestkörpermechanikDresdenGermany

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