Modelling Technologies and Applications

  • C. Bailey
  • H. Lu
  • S. Stoyanov
  • T. Tilford
  • X. Xue
  • M. Alam
  • C. Yin
  • M. Hughes


Numerical modelling technology and software is now being used to underwrite the design of many microelectronic and microsystems components. The demands for greater capability of these analysis tools are increasing dramatically, as the user community is faced with the challenge of producing reliable products in ever shorter lead times.


Computational Fluid Dynamic Solder Joint Dissipative Particle Dynamic Anisotropic Conductive Film Embed Atom Method 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.



The authors would like to acknowledge the financial support from the Engineering and Physical Sciences Research Council (EPSRC) that has supported some of the modelling development work at Greenwich as detailed in the illustrations above. We also acknowledge the 3D-Mintegration consortium (supported under EPSRC fund EP/C534212/) in the UK which is developing fabrication, assembly, packaging and testing procedures for 3D miniaturised products which is also supporting some of the work detailed above.


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Copyright information

© Springer Science+Business Media, LLC 2008

Authors and Affiliations

  • C. Bailey
    • 1
  • H. Lu
    • 1
  • S. Stoyanov
    • 1
  • T. Tilford
    • 1
  • X. Xue
    • 1
  • M. Alam
    • 1
  • C. Yin
    • 1
  • M. Hughes
    • 1
  1. 1.School of Computing and Mathematical SciencesUniversity of GreenwichLondonUK

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