VLSI: Systems on a Chip pp 649-658 | Cite as
SIPPs, Why Do We Need a New Standard for Interconnect Process Parameters ?
Chapter
Abstract
The overall performance of deep sub-micron integrated circuits is dominated by the interconnect. Standard Interconnect Process Parameters (SIPPs) [1] provides an abstract model of the interconnect system, as well as a methodology to derive interconnects electrical parameters from a process description.
SIPPs also enables measurement of process variations and their impact on interconnect performance.
This paper describes in details the SIPPs model, as well as highlights some of the benefits of using a standard for interconnect parameters.
SIPPs is now an SI2 (Silicon Integration Initiative) [2] endorsed standardisation effort.
Key Words
SIPPs interconnect characterisation process extraction modelling Download
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References
- [1]Open SIPPs International “ Proposal for SIPPs, Standard Interconnect Performance Parameters”, California, USA, Sep. 1998Google Scholar
- [2]SI2 “Silicon Integration Initiative”, World-wide-web site hitp://www.si2.org. Texas, USA, 1998Google Scholar
- [3]RaphaelTM v4.0, TMA Inc, Sunnyvale, CA, USA, 1997Google Scholar
- [4]QuickCapTM v1.1, RLC, Fairfax, VA, USA, 1996Google Scholar
- [5]A.Chou, et al.,“Characterization and Application of Interconnect Process Parameters”, Dig. ICMTS,Japan, Mar. 1998.Google Scholar
- [6]L.-F. Chang, et al.,“Incorporating process induced effects into RC extraction”, Dig. VLSI 99,India, January 1999.Google Scholar
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© IFIP International Federation for Information Processing 2000