Miniaturized Wireless Sensors for Automotive Applications

  • R. Thomasius
  • D. D. Polityko
  • H. Reichl
  • M. Niedermayer
  • S. Grundmann
  • S. Guttowski
  • R. Achterholt
Part of the VDI-Buch book series (VDI-BUCH)

Abstract

Innovative packaging technologies and power aware design enable system shrinking considering automotive requirements. During the design process the coupling of very narrow positioned components and the interdependence of hardware, software, and packaging have to be considered. The relevant miniaturisation aspects are discussed on the exemplary application of a tire pressure monitoring system.

Keywords

wireless sensors tire pressure monitoring 3D integration 3D packaging 

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. [1]
    Zeitreihen Verkehr 2004, Statistisches Bundesamt, Wiesbaden, Germany, 2005Google Scholar
  2. [2]
    Unfallursachen/Technische Mängel 2004, Statistisches Bundesamt, Wiesbaden, Germany, 2005.Google Scholar
  3. [3]
    Thiriez, K.; Bondy, N.: NHTSA’s Tire Pressure Special Study, US DOT/National Highway Traffic Safety Administration, Paper Number 256, United States of America, February 2001Google Scholar
  4. [4]
    Federal Motor Vehicle Safety Standards; Tire Pressure Monitoring Systems; Controls and Displays, DEPARTMENT OF TRANSPORTATION, National Highway Traffic Safety Administration, 49 CFR Parts 571 and 585, Docket No. NHTSA 2005-20586, RIN 2127-AJ23Google Scholar
  5. [5]
    Tränkler, H.-R.; Obermeier, E. (Hrsg.): Sensortechnik-Handbuch für Praxis und Wissenschaft, Springer Verlag, Berlin, Heidelberg, New York, 1998Google Scholar
  6. [6]
    Bureau of Transport Statistics, http://www.bts.gov/, Washington D.C., 2005Google Scholar
  7. [7]
    Association of German Automobile Manufacturers, Export Statistics, http://www.vda.de/de/aktuell/statistik/, Frankfurt/M., 2005Google Scholar
  8. [8]
    Polityko, D. D.; Guttowski, S.; John, W.; Reichl, H.: “Physical design and technology para¬me¬ters for vertical system-in-package integration,” Electronics Technology: Meeting the Chal¬lenges of Electronics Technology Progress, 2005. 28th International Spring Seminar on Electronics Technology, no. pp. 413–419, May 19–20, 2005Google Scholar
  9. [9]
    Niedermayer, M.; Polityko, D.; Guttowski, S.; John, W.; Reichl, H.: Entwurfsmethodische Grundlagen zur Miniaturisierung von Autarken Verteilten Systemen, 10. GMM-Workshop Methoden und Werkzeuge für den Entwurf von Mikrosystemen, Cottbus, 21.10.2004Google Scholar
  10. [10]
    Vardaman, E.-J; Carpenter, C.; Matthew, L.: “System-in-Package, The New Wave in 3D Packaging”,Market and Technology Research Report of TechSearch International, Austin, Texas, USA, September 2005Google Scholar

Copyright information

© Springer-Verlag Berlin Heidelberg 2006

Authors and Affiliations

  • R. Thomasius
    • 1
  • D. D. Polityko
    • 1
  • H. Reichl
    • 1
  • M. Niedermayer
    • 2
  • S. Grundmann
    • 2
  • S. Guttowski
    • 2
  • R. Achterholt
    • 3
  1. 1.Technische Universität BerlinBerlinGermany
  2. 2.Fraunhofer IZMBerlinGermany
  3. 3.Global Dynamix AGLandschlachtSwitzerland

Personalised recommendations