Electronic Packaging and Reduction in Modelling Time Using Domain Decomposition
The domain decomposition method is directed to electronic packaging simulation in this article. The objective is to address the entire simulation process chain, to alleviate user interactions where they are heavy to mechanization by component approach to streamline the model simulation process.
Unable to display preview. Download preview PDF.
- V. Voller and C. Swaminathan. General source-based methods for solidificationn phase change. Numerical Heat Transfer, 19:175–190, 1991.Google Scholar