Three-Dimensional Thermal Stress Analysis Considering the Stress Singularity for Bonded Structures

  • H. Koguchi
Conference paper

Abstract

It is well known that stress singularity occurs at a vertex in joints under mechanical loadings and thermal loadings. In the present paper, a singular stress field at a vertex in three-dimensional bonded structures as shown in Fig.1 is analyzed. Stress analysis and eigen analysis are performed, and the intensity of singularity is determined varying mechanical property of thin layer sandwitched between two substrates. Furthermore, thermal stresses at the vertex on an interface in the bonded structures are expressed appropriately using the results in eigen analysis, and the intensity of singularity is determined and arranged for the order of stress singularity using a useful parameter.

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References

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Copyright information

© Springer 2006

Authors and Affiliations

  • H. Koguchi
    • 1
  1. 1.Nagaoka University of TechnologyNagaoka, NiigataJapan

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