Die Attach Quality Testing by Structure Function Evaluation

  • Márta Rencz
  • Vladimir Székely
  • Bernard Courtois
Chapter

Abstract

In this chapter simulation and measurement experiments prove that the structure function evaluation of the thermal transient testing is capable to locate die attach failure(s), even in case of stacked die packages. Both the strength and the location of the die attach failure may be determined with the methodology of a fast thermal transient measurement and the subsequent computer evaluation. The paper presents first the theoretical background of the method. After this, application on single die packages is presented. In the rest of the paper first simulation experiments show the feasibility of locating die attach problem in stacked die structures with the presented algorithm and a large number of measured experiments prove that the methodology is applicable also in practice. At the end of the chapter, in the evaluation of the methodology the special advantage of the method, that normally it does not require any additional circuit elements on any of the possibly-stacked-dies is also presented.

Keywords

Structure Function Thermal Resistance Pyramidal Structure Cold Plate Transient Measurement 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.
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References

  1. 1.
    L. Zhang, N. Howard, V. Gumaste, A. Poddar, and L. Nguyen, Thermal characterization of stacked dies, Proceedings of the XXth SEMI-THERM Symposium, San Jose, CA, USA, March 9–11, 2004, pp. 55–63. Google Scholar
  2. 2.
    C. Lin, S. Chiang, and A. Yang, 3D stackable packages with bumpless interconnect technology, 5th Electronics Packaging Technology Conference, Singapore, 10–12 December 2003. Google Scholar
  3. 3.
    V. Székely and T. van Bien, Fine structure of heat flow path in semiconductor devices: a measurement and identification method, Solid-State Electronics, 31, pp. 1363–1368 (1988). CrossRefGoogle Scholar
  4. 4.
    M. Rencz, V. Székely, A. Morelli, and C. Villa, Determining partial thermal resistances with transient measurements and using the method to detect die attach discontinuities, Proceedings of the XVIIIth SEMI-THERM Symposium, San Jose, CA, USA, March 1–14, 2002, pp. 15–20. Google Scholar
  5. 5.
    M. Rencz and V. Székely, Structure function evaluation of stacked dies, Proceedings of the XXth SEMI-THERM Symposium, San Jose, CA, USA, March 9–11, 2004, pp. 50–54. Google Scholar
  6. 6.
    V. Székely, Distributed RC networks, The circuits and Filters Handbook, CRC Press, USA, 2003, pp. 1202–1221. Google Scholar
  7. 7.
    E.N. Protonotarios and O. Wing, Theory of nonuniform RC lines, IEEE Trans. on Circuit Theory, 14(1), pp. 2–12 (1967). CrossRefGoogle Scholar
  8. 8.
  9. 9.
  10. 10.
  11. 11.
    M. Rencz, V. Székely, B. Courtois, L. Zhang, N. Howard, and L. Nguyen, Die attach quality control of 3D stacked dies, IEMT, 2004, pp. 78–84. Google Scholar
  12. 12.
    V. Székely, M. Rencz, S. Török, and S. Ress, Calculating effective board thermal parameters from transient measurements, IEEE Transactions on Components and Packaging Technology, 24(4), pp. 605–610 (2001). CrossRefGoogle Scholar
  13. 13.
    M. Rencz, A. Poppe, E. Kollár, S. Ress, V. Székely, and B. Courtois, A procedure to correct the error in the structure function based thermal measuring methods, Proceedings of the XXth SEMI-THERM Symposium, San Jose, CA, USA, March 9–11, 2004, pp. 92–98. Google Scholar

Copyright information

© Springer Science+Business Media, LLC 2007

Authors and Affiliations

  • Márta Rencz
    • 1
  • Vladimir Székely
    • 2
  • Bernard Courtois
    • 3
  1. 1.MicReD Ltd.Hungary
  2. 2.Budapest University of Technology and EconomicsHungary
  3. 3.TIMA Laboratory GrenobleFrance

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