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Performance of a Hydromagnetic Squeeze Film Between Longitudinally Rough Conducting Triangular Plates

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Soft Computing for Problem Solving

Part of the book series: Advances in Intelligent Systems and Computing ((AISC,volume 1057))

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Abstract

This study discusses the effect of longitudinal roughness on the performance of a hydromagnetic squeeze film in conducting triangular plates. A stochastic random variable characterizes the longitudinal roughness of the bearing surface. The associated Reynolds’ equation is recourse to the stochastically averaging method of Christensen–Tonder, solving the Reynolds’ equation with Reynolds’ boundary conditions; the pressure is obtained which gives load profile as well. Unlike the transverse roughness case, here, it is found that the load bearing capacity increases due to the standard deviation related to roughness. This situation further improves with the involvement of negatively skewed roughness and variance (−ve). The effect of magnetization and conductivity elevates the situation further.

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Abbreviations

a :

Length of the sides

h :

Film thickness

\(\dot{h}\) :

Squeeze film velocity

μ :

Viscosity

B 0 :

Standardized transverse magnetic field incorporated between the plates

s :

Electrical conductivity of the lubricant

M :

\(B_{0} h\left( {\frac{s}{\mu }} \right)^{{\frac{1}{2}}}\) = Hartmann number

p :

Lubricant pressure

w :

Load carrying capacity

σ*:

Non-dimensional standard deviation (σ/h)

α*:

Non-dimensional variance (α/h)

ε*:

Non-dimensional skewness (ε/h3)

P :

Dimensionless pressure

W :

Dimensionless load bearing capacity.

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Acknowledgements

Fruitful comments and constructive suggestions for improving the quality of the article are acknowledged with thanks.

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Correspondence to R. M. Patel .

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Patel, H.P., Deheri, G.M., Patel, R.M. (2020). Performance of a Hydromagnetic Squeeze Film Between Longitudinally Rough Conducting Triangular Plates. In: Das, K., Bansal, J., Deep, K., Nagar, A., Pathipooranam, P., Naidu, R. (eds) Soft Computing for Problem Solving. Advances in Intelligent Systems and Computing, vol 1057. Springer, Singapore. https://doi.org/10.1007/978-981-15-0184-5_11

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