Abstract
Through-silicon via (TSV)-interposer is very expensive [1,2,3,4,5,6,7,8,9,10]. Silicon bridges are one form of silicon substrates to support heterogeneous integrations. Basically, a bridge is a piece of dummy silicon with RDLs (redistribution-layers) and contact pads, but without TSVs (through-silicon vias), i.e., a TSV-less interposer. Usually, the RDLs and contact pads are fabricated on a dummy silicon wafer and then diced into individual bridges. In this chapter, the fabrication of Intel’s EMIB (embedded multi-die interconnect bridge) [11,12,13] will be mentioned. Also, imec’s bridges [14] for the communications of heterogeneous integrations will be briefly discussed. Finally, ITRI’s TSH (through-silicon hole) interposer (bridge) [15,16,17,18] will be presented.
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Lau, J.H. (2019). Heterogeneous Integrations on Silicon Substrates (Bridges). In: Heterogeneous Integrations. Springer, Singapore. https://doi.org/10.1007/978-981-13-7224-7_4
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DOI: https://doi.org/10.1007/978-981-13-7224-7_4
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