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Powering Implants by Galvanic Coupling: A Validated Analytical Model Predicts Powers Above 1 mW in Injectable Implants

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World Congress on Medical Physics and Biomedical Engineering 2018

Abstract

While galvanic coupling for intrabody communications has been proposed lately by different research groups, its use for powering active implantable medical devices remains almost non-existent. Here it is presented a simple analytical model able to estimate the attainable power by galvanic coupling based on the delivery of high frequency (>1 MHz) electric fields applied as short bursts. The results obtained with the analytical model, which is in vitro validated in the present study, indicate that time-averaged powers above 1 mW can be readily obtained in very thin (diameter < 1 mm) and short (length < 20 mm) elongated implants when fields which comply with safety standards (SAR < 10 W/kg) are present in the tissues where the implants are located. Remarkably, the model indicates that, for a given SAR, the attainable power is independent of the tissue conductivity and of the duration and repetition frequency of the bursts. This study reveals that galvanic coupling is a safe option to power very thin active implants, avoiding bulky components such as coils and batteries.

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References

  1. Becerra-Fajardo, L., Schmidbauer, M., Ivorra, A.: Demonstration of 2 mm thick microcontrolled injectable stimulators based on rectification of high frequency current burst. IEEE Trans Neural Sysy. Rehabil. Eng. 25(8), 1342–52 (2017).

    Google Scholar 

  2. Seyedi, M., Kibret, B., Lai, D.T.H., Faulkner, M.: A survey on intrabody communications for body area network applications. IEEE Trans. Biomed. Eng. 60(8), 2067–79 (2013).

    Google Scholar 

  3. IEEE Standard for Safety Levels With Respect to Human Exposure to Radio Frequency Electromagnetic Fields, 3 kHz to 300 GHz. 1–238 (2006).

    Google Scholar 

  4. Vander Vorst, A., Rosen, A., Kotsuka, Y.: RF/Microwave Interaction with Biological Tissues. New Jersey: John Wiley & Sons, Inc. (2006).

    Google Scholar 

  5. Grimnes, S., Martinsen, Ø.G., Geometrical Analysis, in: Bioimpedance & Bioelectricity basics. 2nd edn. Elseiver, Oxford (2008).

    Google Scholar 

  6. Ho, J.S. et al., Supplementary material in: Wireless power transfer to deep-tissue microimplants. Proc. Natl. Acad. Sci. 111, 7974–7979 (2014).

    Google Scholar 

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Acknowledgements

This project has received funding from the European Research Council (ERC) under the European Union’s Horizon 2020 research and innovation programme (grant agreement No 724244).

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Correspondence to Antoni Ivorra .

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Tudela-Pi, M., Becerra-Fajardo, L., Ivorra, A. (2019). Powering Implants by Galvanic Coupling: A Validated Analytical Model Predicts Powers Above 1 mW in Injectable Implants. In: Lhotska, L., Sukupova, L., Lacković, I., Ibbott, G. (eds) World Congress on Medical Physics and Biomedical Engineering 2018. IFMBE Proceedings, vol 68/3. Springer, Singapore. https://doi.org/10.1007/978-981-10-9023-3_5

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  • DOI: https://doi.org/10.1007/978-981-10-9023-3_5

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-10-9022-6

  • Online ISBN: 978-981-10-9023-3

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