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Die-Attach Materials for High Temperature Applications in Microelectronics Packaging pp 125–150Cite as

Reliability and Failure Mechanisms of Sintered Silver as Die Attach Joint

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Abstract

This chapter reviews the reliability of sintered Ag joint in terms of elastic modulus, shear strength, tensile strength, creep strength, fatigue strength, and related failure mechanisms under normal and accelerated conditions, as well as failure mechanism like electrochemical migration. While it is technically feasible to produce sintered Ag joint to meet the package design requirement, its long-term reliability is a subject of continuous research and development. Sufficient densification and microstructure stability (grain boundary and interfacial metallization quality) of the sintered Ag joints form the critical strategies in producing a reliable joint. With a better understanding of the failure mechanisms and contributing factors described in this chapter, modifications in Ag paste formulation, sintering conditions, interfacial metallization, and innovative package designs will be able to alleviate these issues to improve the community’s confidence in this bonding technique.

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Acknowledgment

SKS acknowledges Universiti Kebangsaan Malaysia Research Grants (GUP-2017-055 “Production of Metallic Conducting Nanowires for Industrial Applications”) for this work.

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Authors and Affiliations

  1. Tianjin Key Laboratory of Advanced Joining Technology & Center of High-Temperature Electronic Packaging, School of Materials Science and Engineering, Tianjin University, Tianjin, China

    Y. H. Mei & Z. Wang

  2. Key Laboratory of Advanced Ceramics and Machining Technology, Ministry of Education, Tianjin, China

    Y. H. Mei & Z. Wang

  3. Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, Bangi, Malaysia

    K. S. Siow

Authors
  1. Y. H. Mei
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  2. Z. Wang
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  3. K. S. Siow
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Corresponding author

Correspondence to Y. H. Mei .

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Editors and Affiliations

  1. Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, Bangi Selangor, Malaysia

    Kim S. Siow

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Mei, Y.H., Wang, Z., Siow, K.S. (2019). Reliability and Failure Mechanisms of Sintered Silver as Die Attach Joint. In: Siow, K. (eds) Die-Attach Materials for High Temperature Applications in Microelectronics Packaging. Springer, Cham. https://doi.org/10.1007/978-3-319-99256-3_5

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