Abstract
Based on the experimental and analytical framework developed in the previous chapter, we develop here the requirements needed for quantitative comparison and estimation of thermal properties. Using an analytical model for the thermal spreading resistance in the sample, quantities such as thermal conductivity and interface thermal resistance can be deduced from SThM measurements. We apply similar models to relatively simple samples, oxide layers on silicon substrates to demonstrate the principles underlying these models. Finally, metal covered block copolymers thin films are mapped and their thermal resistances measured to extract effective thermal conductivities.
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References
Yovanovich MM, Culham JR, Teertstra P (1998) IEEE Trans Compon Packag Manuf Technol: Part A 21:168–176
Muzychka YS (2014) J Thermophys Heat Transf 28:313–319
Assy A, Gomes S (2015) Nanotechnology 26:355401
Muzychka YS, Yovanovich MM, Culham JR (2004) J Thermophys Heat Transf 18:45–51
Menges F, Riel H, Stemmer A, Dimitrakopoulos C, Gotsmann B (2013) Phys Rev Lett 111:205901
Al Mohtar A, Tessier G, Ritasalo R, Matvejeff M, Stormonth-Darling J, Dobson P, Chapuis P, Gomes S, Roger J (2017) Thin Solid Films 642:157–162
Chien H-C, Yao D-J, Huang M-J, Chang T-Y (2008) Rev Sci Instrum 79:054902
Zhu J, Tang D, Wang W, Liu J, Holub KW, Yang R (2010) J Appl Phys 108:094315
Muzychka YS, Sridhar MR, Yovanovich MM, Antonetti VW (1999) J Thermophys Heat Transf 13:489–494
Glassbrenner C, Slack GA (1964) Phys Rev 134:A1058
Dryden J (1983) J Heat Transf 105:408–410
Liu J, Ju S, Ding Y, Yang R (2014) Appl Phys Lett 104:153110
Jakubinek MB, White MA, Mu M, Winey KI (2010) Appl Phys Lett 96:083105
Juangsa FB, Muroya Y, Ryu M, Morikawa J, Nozaki T (2016) J Phys D: Appl Phys 49:365303
Lysenkov E, Klepko V (2015) J Eng Phys Thermophys 88:1008–1014
Hu C, Kiene M, Ho PS (2001) Appl Phys Lett 79:4121–4123
Zheng K, Sun F, Tian X, Zhu J, Ma Y, Tang D, Wang F (2015) ACS Appl Mater Interfaces 7:23644–23649
Gotsmann B, Lantz MA, Knoll A, Dürig U (2010) Nanotechnology 121–160
Lefèvre S, Volz S, Saulnier J-B, Fuentes C, Trannoy N (2003) Rev Sci Instrum 74:2418–2423
Gomes S, David L, Lysenko V, Descamps A, Nychyporuk T, Raynaud M (2007) J Phys D-Appl Phys 40:6677–6683
Bodzenta J, Juszczyk J, Chirtoc M (2013) Rev Sci Instrum 84:093702
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Spièce, J. (2019). Quantitative Thermal Transport Measurements in Nanostructures. In: Quantitative Mapping of Nanothermal Transport via Scanning Thermal Microscopy. Springer Theses. Springer, Cham. https://doi.org/10.1007/978-3-030-30813-1_4
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DOI: https://doi.org/10.1007/978-3-030-30813-1_4
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