Abstract
Chapter 1 provides an introduction on the use and application of lead- free solders in the semiconductor packaging and electronics manufacturing industry. The importance of solder joint reliability testing and assessments is described within a framework of a DFR methodology. This DFR methodology provides a systematic approach to understanding the mechanics of deformation of solder materials, characterizing the mechanical properties, constitutive models for creep and viscoplastic analysis, fatigue life prediction models, which are then employed in a finite element modeling and simulation analysis to assess the solder joint reliability performance.
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References
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Pang, J.H.L. (2012). Introduction. In: Lead Free Solder. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-0463-7_1
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DOI: https://doi.org/10.1007/978-1-4614-0463-7_1
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