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Open Source TCAD/EDA for Compact Modeling

  • Book
  • Mar 2025
  • Latest edition

Overview

  • The first book to explore Open Source TCAD/EDA tools for compact modeling
  • Features contributions from leading international researchers and professionals in the field
  • Offers a multi-disciplinary approach which will appeal to physicists, engineers and computer scientists

Part of the book series: Springer Series in Advanced Microelectronics (MICROELECTR., volume 59)

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About this book

The aim of this book is to highlight the benefits of a higher interoperability between Technology Computer-Aided Design and Electronic Design Automation, focusing on specifically selected open source tools for compact modeling.

Due to the tremendous developments in semiconductor technology in recent years, device level modelling and integrated circuit design have become intimately related. However, they have been traditionally disconnected up to the circuit level. This book consists of a set of extended user manuals guiding the reader from the usual software, from multidimensional numerical process and device simulations, through compact model development and its Verilog-A standardization to carefully selected IC designs for analog, radio frequency and digital applications.

Bringing together contributions from academic and industrial researchers and engineers, the book forms a valuable reference for students and those working in the field.

Keywords

  • Analog/digital SPICE simulations
  • Compact Modeling book
  • Compact Modeling reviews
  • Computer Aided Design
  • Integrated Circuit microfabrication
  • MOS-AK/GSA compact modeling
  • Open Source tools for compact modeling
  • Process/device CAD simulations
  • Verilog-A modeling
  • Technology Computer-Aided Design (TCAD)
  • Electronic Design Automation (EDA)

Editors and Affiliations

  • MOS-AK (EU), Commugny, Switzerland

    Wladyslaw Grabinski

  • Silicon Microsystem and Nanostructures, Institute of Electron Technology, Warsaw, Poland

    Daniel Tomaszewski

About the editors

Wladek Grabinski received the Ph.D. degree from the Institute of Electron Technology, Warsaw, Poland, in 1991. From 1991 to 1998 he was a Research Assistant at the Integrated Systems Lab, ETH Zürich, Switzerland, supporting the CMOS and BiCMOS technology developments by electrical characterization of the processes and devices. From 1999 to 2000, he was with LEG, EPF Lausanne, and was engaged in the compact MOSFET model developments supporting numerical device simulation and parameter extraction. Later, he was a technical staff engineer at Motorola, and subsequently at Freescale Semiconductor, Geneva Modeling Center, Switzerland. He is now an consultant responsible for modeling, characterization and parameter extraction of MOS transistors for the design of RF CMOS circuits. He is currently consulting on the development of next-generation compact models for the 65–32-nm-technology very large scale integration (VLSI) circuit simulation. His current research interests are in high-frequency characterization, compact modeling and its Verilog-A standardization as well as device numerical simulations of MOSFETs for analog/RF low power applications. He is an editor of the reference modeling book Transistor Level Modeling for Analog/RF IC Design and also authored or coauthored more than 50 papers. Wladek has served as a member in IEEE EDS Compact Modeling Committee, organization committee of ESSDERC/ESSDERC, TPC of SBMicro, SISPAD, MIXDES Conferences. He also serves as European representative for the ITRS Modeling and Simulation working group. Wladek is involved in activities of the MOS-AK/GSA compact modeling group and serves as a coordinating manager since 1999.

Bibliographic Information

  • Book Title: Open Source TCAD/EDA for Compact Modeling

  • Editors: Wladyslaw Grabinski, Daniel Tomaszewski

  • Series Title: Springer Series in Advanced Microelectronics

  • Publisher: Springer Dordrecht

  • eBook Packages: Engineering, Engineering (R0)

  • Copyright Information: Springer Nature B.V. 2025

  • Hardcover ISBN: 978-94-024-1089-1Due: 12 April 2025

  • Softcover ISBN: 978-94-024-2199-6Due: 12 April 2026

  • eBook ISBN: 978-94-024-1091-4Due: 12 April 2025

  • Series ISSN: 1437-0387

  • Series E-ISSN: 2197-6643

  • Edition Number: 1

  • Number of Pages: CCL

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