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4th International Conference on Electronics and Signal Processing

ICESP 2023

  • Conference proceedings
  • © 2024

Overview

  • Presents the proceedings of the 4th International Conference on Electronics and Signal Processing (ICESP 2023), Macau, January 13-15, 2023
  • Includes topics such as Analog and Mixed Signal Processing, Array Signal Processing, Digital Signal Processing, and Signal Processing for Communications
  • Features research from academics, students, professors, and practitioners in electronics and signal processing

Part of the book series: Signals and Communication Technology (SCT)

Included in the following conference series:

Conference proceedings info: ICESP 2023.

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Table of contents (9 papers)

  1. Data Model and Image Analysis

  2. Signal Detection and Estimation

  3. Modern Electronic Information System and Control Technology

Other volumes

  1. 4th International Conference on Electronics and Signal Processing

Keywords

About this book

This book presents the proceedings of the 4th International Conference on Electronics and Signal Processing (ICESP 2023), which was held in Macau, China during January 13-15, 2023. The book consists of contributions from various authors from both academia and industry, focusing on a diverse aspect of signal processing and information communication systems. The published papers suggest cutting-edge solutions that contribute to the quest for the future applications and communicating systems. The book is a useful reference to research students, research fellows, and scientists and engineers in the corresponding fields.

Editors and Affiliations

  • Daegu University Gyeongsan, Gyeongsan-si, Korea (Republic of)

    Seokwon Yeom

About the editor

Seokwon Yeom has been a faculty member of Daegu University since 2007. He is now a full professor of the same university, School of AI. He has a Ph.D. in Electrical and Computer Engineering from the University of Connecticut in 2006.  His research interests are intelligent image/optical information processing, deep/machine learning, and target tracking. He has researched on multiple target tracking for the airborne early warning system, three-dimensional image processing with digital holography and integral imaging, photon-counting linear discriminant analysis and photon-counting nonlinear matched filter, millimeter wave and infrared image analysis, and long-distance target tracking for aerial surveillance and search and rescue mission with a small unmanned aerial vehicle.  He has been a guest editor of Applied Sciences and Drones in MDPI. He has served as a board member of the Korean Institute of Intelligent Systems, and a member of the board of directors of the Korean Institute of Convergence Signal Processing. He was program chair of ICCCS2015, ISIS2017, iFUZZY2018, ICCCS2019, ADIP2021-2023, IPMV2024. He was a vice director of the AI homecare center and a head of the department of IT convergence engineering at Daegu University in 2020, a visiting scholar at the University of Maryland in 2014, and a director of the Gyeongbuk techno-park specialization center in 2013.

Bibliographic Information

  • Book Title: 4th International Conference on Electronics and Signal Processing

  • Book Subtitle: ICESP 2023

  • Editors: Seokwon Yeom

  • Series Title: Signals and Communication Technology

  • DOI: https://doi.org/10.1007/978-3-031-36670-3

  • Publisher: Springer Cham

  • eBook Packages: Engineering, Engineering (R0)

  • Copyright Information: The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Switzerland AG 2024

  • Hardcover ISBN: 978-3-031-36669-7Published: 28 November 2023

  • Softcover ISBN: 978-3-031-36672-7Due: 29 December 2023

  • eBook ISBN: 978-3-031-36670-3Published: 27 November 2023

  • Series ISSN: 1860-4862

  • Series E-ISSN: 1860-4870

  • Edition Number: 1

  • Number of Pages: X, 112

  • Number of Illustrations: 12 b/w illustrations, 47 illustrations in colour

  • Topics: Communications Engineering, Networks, Signal, Image and Speech Processing, Electrical Engineering

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