Building ASIPS: The Mescal Methodology

  • Matthias Gries
  • Kurt Keutzer

Table of contents

  1. Front Matter
    Pages n1-xxx
  2. Introduction and Motivation

    1. Kurt Keutzer
      Pages 1-29
  3. The MESCAL Methodology for Building ASIPs

    1. Front Matter
      Pages 31-31
    2. Mel Tsai, Niraj Shah, Chidamber Kulkarni, Christian Sauer, Matthias Gries, Kurt Keutzer
      Pages 33-56
    3. Niraj Shah, Christian Sauer, Matthias Gries, Yujia Jin, Matthew Moskewicz, Kurt Keutzer
      Pages 57-83
    4. Scott Weber, Yujia Jin, Matthias Gries, Christian Sauer, Matthew Moskewicz
      Pages 85-130
    5. Matthias Gries, Yujia Jin
      Pages 131-177
    6. Niraj Shah, William Plishker, Kaushik Ravindran, Matthias Gries, Scott Weber, Andrew Mihal et al.
      Pages 179-225
  4. Using Commercial Tools to Apply the MESCAL Methodology for Building ASIPs

    1. Front Matter
      Pages 227-227
    2. Heinrich Meyr, Oliver Schliebusch, Andreas Wieferink, David Kammler, Ernst Martin Witte, Olaf Lüthje et al.
      Pages 229-280
    3. Grant Martin, Steve Leibson
      Pages 281-310
  5. Back Matter
    Pages 313-350

About this book


An increasing number of system designers are using ASIP’s rather than ASIC’s to implement their system solutions. Building ASIPs: The Mescal Methodology gives a simple but comprehensive methodology for the design of these application-specific instruction processors (ASIPs).

The key elements of this methodology are:

Judiciously using benchmarking

Inclusively identifying the architectural space

Efficiently describing and evaluating the ASIPs

Comprehensively exploring the design space

Successfully deploying the ASIP

This book includes demonstrations of applications of the methodologies using the Tipi research framework as well as state-of-the-art commercial toolsets from CoWare and Tensilica.


architecture design integrated circuit modeling system on chip (SoC)

Editors and affiliations

  • Matthias Gries
    • 1
  • Kurt Keutzer
    • 1
  1. 1.Electronics Research LaboratoryUniversity of California at BerkeleyBerkeley

Bibliographic information

  • DOI
  • Copyright Information Springer Science+Business Media, Inc. 2005
  • Publisher Name Springer, Boston, MA
  • eBook Packages Engineering
  • Print ISBN 978-0-387-26057-0
  • Online ISBN 978-0-387-26128-7
  • Buy this book on publisher's site