An Empirical Investigation into Child Abuse and Neglect in India

Burden, Impact and Protective Measures

  • Sibnath┬áDeb

Part of the SpringerBriefs in Well-Being and Quality of Life Research book series (BRIEFSWELLBEING)

About this book

Introduction

This book provides a comprehensive overview of child abuse and neglect globally in general terms and with empirical evidence from Puducherry, India. The study unearths the reality concerning child safety and raises a number of questions about child safety measures at the institutional and family levels. It recommends evidence-based and culture-specific preventive measures for child protection. The empirical evidence presented here provides important and useful information to school administrators on the issues of child abuse and neglect, for them to take evidence-based protective measures both at school and at home. For cross-cultural comparison, the findings are of interest to international scholars and academics. This work is useful for policy makers, educators, NGO personnel, child rights activists and opinion leaders in government departments dealing with children, and for researchers in the fields of psychology, social work, nursing, pediatric, forensic medicine, and public health. 

Keywords

corporal punishment in schools children in institutional care mental health of abused children substance abuse in abused children working children street children child trafficking in South Asia HIV/AIDS in children religion and child abuse crimes against children in India child marriage schemes to protect children childline serivces

Authors and affiliations

  • Sibnath┬áDeb
    • 1
  1. 1.Department of Applied PsychologyPondicherry UniversityPuducherryIndia

Bibliographic information

  • DOI https://doi.org/10.1007/978-981-10-7452-3
  • Copyright Information The Author(s) 2018
  • Publisher Name Springer, Singapore
  • eBook Packages Social Sciences
  • Print ISBN 978-981-10-7451-6
  • Online ISBN 978-981-10-7452-3
  • Series Print ISSN 2211-7644
  • Series Online ISSN 2211-7652
  • About this book