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Electrical Design of Through Silicon Via

  • Manho Lee
  • Jun So Pak
  • Joungho Kim

Table of contents

  1. Front Matter
    Pages i-ix
  2. Jun So Pak, Joungho Kim
    Pages 1-21
  3. Joohee Kim, Jun So Pak, Joungho Kim
    Pages 23-60
  4. Heegon Kim, Jun So Pak, Joungho Kim
    Pages 61-114
  5. Jonghyun Cho, Jun So Pak, Joungho Kim
    Pages 115-146
  6. Manho Lee, Jun So Pak, Joungho Kim
    Pages 147-172
  7. Eunseok Song, Jun So Pak, Joungho Kim
    Pages 225-272
  8. Back Matter
    Pages 273-280

About this book

Introduction

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity, and even thermal integrity. Most of the analysis in this book include simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have been studied deep into a TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.

Keywords

3-Dimensional Integrated Circuit Design Clock Distribution Networks High Speed IC Design Noise Coupling On-Chip Decoupling Power Distribution Networks Power Integrity Signal Integrity Thermal Effects Through Silicon Via (TSV)

Editors and affiliations

  • Manho Lee
    • 1
  • Jun So Pak
    • 2
  • Joungho Kim
    • 3
  1. 1.Electrical EngineeringKAISTDaejeonKorea, Republic of (South Korea)
  2. 2.System LSISamsung Electronics Co., LtdHwaseongKorea, Republic of (South Korea)
  3. 3.Electrical Engineering, Department ChairKAISTDaejeonKorea, Republic of (South Korea)

Bibliographic information

  • DOI https://doi.org/10.1007/978-94-017-9038-3
  • Copyright Information Springer Science+Business Media Dordrecht 2014
  • Publisher Name Springer, Dordrecht
  • eBook Packages Engineering
  • Print ISBN 978-94-017-9037-6
  • Online ISBN 978-94-017-9038-3
  • Buy this book on publisher's site