The Malaysia-Japan Model on Technology Partnership

International Proceedings 2013 of Malaysia-Japan Academic Scholar Conference

  • Khairuddin Ab. Hamid
  • Osamu Ono
  • Anas Muhamad Bostamam
  • Amy Poh Ai Ling

Table of contents

  1. Front Matter
    Pages i-xvii
  2. Science and Technology

    1. Front Matter
      Pages 1-1
    2. Leong HungYang, Yap BoonKar, Navas Khan, Mohd Rusli Ibrahim, L. C. Tan
      Pages 35-47
    3. Nurul Najwa Ani, Ahmad Nizar Harun, Saiful Farhan M. Samsuri, Robiah Ahmad
      Pages 49-58
    4. Fitri Yakub, Ahmad Zahran Md. Khudzari, Yasuchika Mori
      Pages 59-70
    5. Ali Adli, YT Ooi, YL Tan Isaac, WY Ho Katrina, HM Chai, Seet Ruijia et al.
      Pages 71-83
  3. Mechanical and Manufacturing Engineering

  4. Social Sciences and Humanities

    1. Front Matter
      Pages 155-155
    2. Dayang Nailul Munna Abg Abdullah, Vanissa Karupaiah
      Pages 157-165
    3. Junainah Junid, Siti Zahrah Buyong, Khuzaimah Akasah
      Pages 167-175

About these proceedings

Introduction

The selected papers included in this proceedings on Malaysia-Japan Academic Scholar Conference (MJASC) 2013, are related to nano-science engineering, mechanical engineering, electrical and electronic engineering, computer science, information technology etc. This proceedings will be a source of research findings for Malaysia and Japan specifically, and other countries in general, especially among researchers, industry sectors and government policy makers. It will be served as a resourceful reference and platform to reflect the significant of the Look East Policy outcomes and products.

Keywords

Activation of Fibrinolytic Pathway Hematopoietic Regeneration Information Security Systems Look East Policy MJASS 2013 Malaysia-Japan Academic Scholar Seminar 2013 Technology Transfer Asia

Editors and affiliations

  • Khairuddin Ab. Hamid
    • 1
  • Osamu Ono
    • 2
  • Anas Muhamad Bostamam
    • 3
  • Amy Poh Ai Ling
    • 4
  1. 1.Universiti Malaysia SarawakSawawakMalaysia
  2. 2.Meiji UniversityTokyoJapan
  3. 3.Sony CorporationTokyoJapan
  4. 4.The University of TokyoTokyoJapan

Bibliographic information

  • DOI https://doi.org/10.1007/978-4-431-54439-5
  • Copyright Information Springer Japan 2015
  • Publisher Name Springer, Tokyo
  • eBook Packages Engineering
  • Print ISBN 978-4-431-54438-8
  • Online ISBN 978-4-431-54439-5
  • About this book