Wafer Bonding

Applications and Technology

  • Marin Alexe
  • Ulrich Gösele

Part of the Springer Series in MATERIALS SCIENCE book series (SSMATERIALS, volume 75)

Table of contents

  1. Front Matter
    Pages I-XV
  2. G. K. Celler, A. J. Auberton-Hervé, B. Aspar, C. Lagahe-Blanchard, C. Maleville
    Pages 85-105
  3. K. Sakaguchi, T. Yonehara
    Pages 107-156
  4. K. W. Guarini, H.-S. P. Wong
    Pages 157-191
  5. T. D. Sands, W. S. Wong, N. W. Cheung
    Pages 377-415
  6. M. Levy, A. M. Radojevic
    Pages 417-450
  7. M. Alexe, I. Radu, I. Szafraniak
    Pages 451-471
  8. Back Matter
    Pages 495-503

About this book

Introduction

During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Keywords

Compound semiconductors Diode Helium-Atom-Streuung MEMS Semiconductor Silicon-on-insulator Wafer Wafer bonding basics crystal integrated circuit logic optoelectronics semiconductors

Editors and affiliations

  • Marin Alexe
    • 1
  • Ulrich Gösele
    • 1
  1. 1.Max-Planck Institute of Microstructure PhysicsHalle (Saale)Germany

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-662-10827-7
  • Copyright Information Springer-Verlag Berlin Heidelberg 2004
  • Publisher Name Springer, Berlin, Heidelberg
  • eBook Packages Springer Book Archive
  • Print ISBN 978-3-642-05915-5
  • Online ISBN 978-3-662-10827-7
  • Series Print ISSN 0933-033X
  • Series Online ISSN 2196-2812
  • About this book