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Micro System Technologies 90

1st International Conference on Micro Electro, Opto, Mechanic Systems and Components Berlin, 10–13 September 1990

  • Herbert Reichl

Table of contents

  1. Front Matter
    Pages I-XV
  2. Simulation and Design

    1. Front Matter
      Pages 1-1
    2. Design of Micro Systems

      1. K. D. Müller-Glaser, H. Rauch, W. Wolz, J. Bortolazzi, C. Kuntzsch, R. Zippelius
        Pages 9-16
      2. Selden Crary, Sridhar Kota
        Pages 17-22
      3. Richard Amster, Lee S. Tavrow, Anita M. Flynn
        Pages 23-28
    3. CAD of Optical Devices

      1. C. M. Weinert, H.-P. Nolting
        Pages 38-43
      2. V. A. Sychugov, A. V. Tishchenko, M. S. Klimov, O. Parriaux
        Pages 44-51
      3. K. Kapser, P. P. Deimel
        Pages 52-58
    4. Simulation and Design — Electrical and Thermal Properties

    5. Simulation and Design of Sensors

      1. Henry Baltes
        Pages 117-124
      2. David Moser, Paulo Sigg, Stephane Ansermet, Henry Baltes
        Pages 125-130
      3. William C. Dunn
        Pages 131-136
  3. Measurement and Testing

    1. Front Matter
      Pages 137-137
    2. Testing

    3. Material Characterization — Physical Properties

      1. S. Kawai, A. Nishimura, M. Kitano, T. Shimizu
        Pages 161-176
      2. S. Büttgenbach, W. Engelhardt, W. Kulcke
        Pages 177-182
      3. A. Drost, D. Hemmetzberger, J. Emmer
        Pages 183-189
    4. Material Characterisation — Semiconductor Charateristics

    5. Material Characterization — Optical Methods

      1. M. Tamme, R. Kamilli, P. Paduschek, M. Stadtmüller
        Pages 225-230
      2. B. D. Doi, K. Hammann, A. Röseler, U. Schneider, H. Schwiecker
        Pages 238-243
  4. Materials

    1. Front Matter
      Pages 245-245
    2. Materials for Packaging and Passivation

      1. H. Burghardt, H. Cebulla, W. Leimbrock, W. Leyffer, D. Thess, K. Drescher
        Pages 247-254
      2. Philip Philippov, N. Nicolov
        Pages 261-266
      3. Kevin K. T. Chung, Garrett Dreier, Eldon Avery, Andy Boyle, William Koehn, Guido Govaert et al.
        Pages 273-274
    3. Integrated Optics Materials and Technologies

      1. B. Schüppert, J. Schmidtchen, A. Splett, K. Petermann
        Pages 277-282
      2. H. Bezzaoui, A. Baus, E. Voges
        Pages 283-288
      3. N. Keil, B. Strebel, H. H. Yao
        Pages 289-294
  5. Technologies

    1. Front Matter
      Pages 295-295
    2. Pattern Generation and Image Transfer

      1. M. Popall, H. Meyer, J. Schulz
        Pages 297-306
      2. A. Hammerschmidt, S. Birkle, J. Kammermaier, R. Leuschner, W. Schmidt, R. Schulte
        Pages 307-312
      3. L. Bauch, U. Jagdhold, W. Höppner, J. Bauer, R. Klabes, G. Mehliß et al.
        Pages 313-318
      4. H. Joseph Weaver, Gary E. Sommargren
        Pages 319-322

About these proceedings

Introduction

On September 10-13, 1990, the first international meeting on Microsystem Technologies takes place at the Berlin International Congress Center. Most of the traditional congresses deal with themes that become more and more specific, and only a small part of the scientific world is reflected. The Micro System Technologies is attempting to take the opposite direction: During the last two decades the development of microelectronics was characterized by a tremendous increase of complexity of integrated circuits. At the same time the fields of microoptics and micromechanics have been developed to an advanced state of the art by the application of thin film and semiconductor technologies. The trend of the future development is to increase the integration density by combining the microelectronic, microoptic, and micro mechanic aspects to new complex multifunctional systems, which are able to comprise sensors, actuators, analogue and digital circuits on the same chip or on multichip-modules. Microsystems will lead to extensions of the field of microelectronic applications with important technical alterations and can open new considerable markets. For the realization of economical solutions for microsystems a lot of interdisciplinary cooperation and know-how has to be developed. New materials for sensitive layers, substrates, conducting, semiconducting, or isolating thin films are the basis for the development of new technologies. The increasing complexity leads to increasing interaction among electrical and non-electrical quantities.

Keywords

Sensor Technologie complexity computer-aided design (CAD) design development electronics integrated circuit laser material mechanics optics semiconductor sensors simulation

Editors and affiliations

  • Herbert Reichl
    • 1
  1. 1.Forschungsschwerpunkt Technologie der MikroperipherikTechnische Universität BerlinBerlin 10Germany

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-642-45678-7
  • Copyright Information Springer-Verlag Berlin Heidelberg 1990
  • Publisher Name Springer, Berlin, Heidelberg
  • eBook Packages Springer Book Archive
  • Print ISBN 978-3-642-45680-0
  • Online ISBN 978-3-642-45678-7
  • Buy this book on publisher's site