Future Visions on Biomedicine and Bioinformatics 2

A Liber Amicorum in Memory of Swamy Laxminarayan

  • Lodewijk Bos
  • Denis Carroll
  • Luis Kun
  • Andrew Marsh
  • Laura M. Roa

Part of the Communications in Medical and Care Compunetics book series (CMCC, volume 2)

Table of contents

  1. Front Matter
    Pages i-v
  2. Ron Oberleitner, Rebecca Wurtz, Michael L. Popovich, Reno Fiedler, Tim Moncher, Swamy Laxminarayan et al.
    Pages 1-8
  3. R. Istepanian, N. Philip, X. H. Wang, S. Laxminarayan
    Pages 9-16
  4. Lodewijk Bos, Swamy Laxminarayan, Andy Marsh
    Pages 21-25
  5. Andy Marsh, Swamy Laxminarayan, Lodewijk Bos
    Pages 27-39
  6. Back Matter
    Pages 41-105

About this book


Swamy Laxminarayan was an outstanding researcher active in many diverse fields of science and technology. He was one of the most prominent biomedical scientists and his ideas influenced the Biomedical Technology substantially. This book tries to provide an overview on the multiple achievements of Swamy Laxminarayan.

It presents the breadth of his interests by a collection of his last publications as well as an overview on his outstanding life. This volume is the second part of the liber amicorum in memory of Swamy Laxminarayan.


Biomedical information technology Bioterrorism Health Informatics Healthcare compunetics Homeland Security ICMCC care compunetics Swamy Laxminarayan mobile mhealth

Editors and affiliations

  • Lodewijk Bos
    • 1
  • Denis Carroll
    • 2
  • Luis Kun
    • 3
  • Andrew Marsh
    • 4
  • Laura M. Roa
    • 5
  1. 1.& Care CompuneticsInternational Council on MedicalUtrechtNetherlands
  2. 2., Head of KTP UnitUniversity of WestminsterLondonUnited Kingdom
  3. 3., Center for Information Assurance EducatiNational Defense UniversityWashington, DCUSA
  4. 4.VMW Solutions LtdHampshireUnited Kingdom
  5. 5., Departamento de Ingenería de SystemasUniversity of SevilleSevillaSpain

Bibliographic information

  • DOI
  • Copyright Information Springer-Verlag Berlin Heidelberg 2011
  • Publisher Name Springer, Berlin, Heidelberg
  • eBook Packages Engineering
  • Print ISBN 978-3-642-19553-2
  • Online ISBN 978-3-642-19554-9
  • Series Print ISSN 2191-3811
  • Buy this book on publisher's site