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Low-Power CMOS Digital Pixel Imagers for High-Speed Uncooled PbSe IR Applications

  • Josep Maria Margarit

Part of the Springer Theses book series (Springer Theses)

Table of contents

  1. Front Matter
    Pages i-xxi
  2. Josep Maria Margarit
    Pages 1-37
  3. Josep Maria Margarit
    Pages 39-72
  4. Josep Maria Margarit
    Pages 73-99
  5. Josep Maria Margarit
    Pages 169-173

About this book

Introduction

This book describes the development of a new low-cost medium wavelength IR (MWIR) monolithic imager technology for high-speed uncooled industrial applications. It takes the baton on the latest technological advances in the field of vapor phase deposition (VPD) PbSe-based MWIR detection accomplished by the industrial partner NIT S.L., adding fundamental knowledge on the investigation of novel VLSI analog and mixed-signal design techniques at circuit and system levels for the development of the readout integrated device attached to the detector. In order to fulfill the operational requirements of VPD PbSe, this work proposes null inter-pixel crosstalk vision sensor architectures based on a digital-only focal plane array (FPA) of configurable pixel sensors. Each digital pixel sensor (DPS) cell is equipped with fast communication modules, self-biasing, offset cancellation, analog-to-digital converter (ADC) and fixed pattern noise (FPN) correction. In-pixel power consumption is minimized by the use of comprehensive MOSFET subthreshold operation.

Keywords

Monolithic Image Sensors Vapour Phase Deposition (VPD) PbSe CMOS Readout Integrated Circuits (ROICs) Digital Pixel Sensor (DPS) Fixed-pattern Noise (FPN) Calibration High-speed MWIR Imagers Uncooled Photonic Sensors Low-power Mixed-signal VLSI Design Event-driven Imagers

Authors and affiliations

  • Josep Maria Margarit
    • 1
  1. 1.Centro Nacional de MicroelectrónicaInstitut de Microelectrònica deBarcelona Centro Nacional de MicroelectrónicaBarcelonaSpain

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-319-49962-8
  • Copyright Information Springer International Publishing AG 2017
  • Publisher Name Springer, Cham
  • eBook Packages Engineering
  • Print ISBN 978-3-319-49961-1
  • Online ISBN 978-3-319-49962-8
  • Series Print ISSN 2190-5053
  • Series Online ISSN 2190-5061
  • Buy this book on publisher's site