On-Chip Power Delivery and Management

  • Inna P. Vaisband
  • Renatas Jakushokas
  • Mikhail Popovich
  • Andrey V. Mezhiba
  • Selçuk Köse
  • Eby G. Friedman

Table of contents

  1. Front Matter
    Pages i-xxxvii
  2. General Background

    1. Front Matter
      Pages 1-2
    2. Inna P.-Vaisband, Renatas Jakushokas, Mikhail Popovich, Andrey V. Mezhiba, Selçuk Köse, Eby G. Friedman
      Pages 3-21
    3. Inna P.-Vaisband, Renatas Jakushokas, Mikhail Popovich, Andrey V. Mezhiba, Selçuk Köse, Eby G. Friedman
      Pages 23-50
    4. Inna P.-Vaisband, Renatas Jakushokas, Mikhail Popovich, Andrey V. Mezhiba, Selçuk Köse, Eby G. Friedman
      Pages 51-60
    5. Inna P.-Vaisband, Renatas Jakushokas, Mikhail Popovich, Andrey V. Mezhiba, Selçuk Köse, Eby G. Friedman
      Pages 61-74
    6. Inna P.-Vaisband, Renatas Jakushokas, Mikhail Popovich, Andrey V. Mezhiba, Selçuk Köse, Eby G. Friedman
      Pages 75-91
    7. Inna P.-Vaisband, Renatas Jakushokas, Mikhail Popovich, Andrey V. Mezhiba, Selçuk Köse, Eby G. Friedman
      Pages 93-93
  3. Power Delivery Networks

    1. Front Matter
      Pages 95-95
    2. Inna P.-Vaisband, Renatas Jakushokas, Mikhail Popovich, Andrey V. Mezhiba, Selçuk Köse, Eby G. Friedman
      Pages 97-128
    3. Inna P.-Vaisband, Renatas Jakushokas, Mikhail Popovich, Andrey V. Mezhiba, Selçuk Köse, Eby G. Friedman
      Pages 129-144
    4. Inna P.-Vaisband, Renatas Jakushokas, Mikhail Popovich, Andrey V. Mezhiba, Selçuk Köse, Eby G. Friedman
      Pages 145-153
    5. Inna P.-Vaisband, Renatas Jakushokas, Mikhail Popovich, Andrey V. Mezhiba, Selçuk Köse, Eby G. Friedman
      Pages 155-155
  4. On-Chip Decoupling Capacitors

    1. Front Matter
      Pages 157-158
    2. Inna P.-Vaisband, Renatas Jakushokas, Mikhail Popovich, Andrey V. Mezhiba, Selçuk Köse, Eby G. Friedman
      Pages 159-197
    3. Inna P.-Vaisband, Renatas Jakushokas, Mikhail Popovich, Andrey V. Mezhiba, Selçuk Köse, Eby G. Friedman
      Pages 199-224
    4. Inna P.-Vaisband, Renatas Jakushokas, Mikhail Popovich, Andrey V. Mezhiba, Selçuk Köse, Eby G. Friedman
      Pages 225-244
    5. Inna P.-Vaisband, Renatas Jakushokas, Mikhail Popovich, Andrey V. Mezhiba, Selçuk Köse, Eby G. Friedman
      Pages 245-253
    6. Inna P.-Vaisband, Renatas Jakushokas, Mikhail Popovich, Andrey V. Mezhiba, Selçuk Köse, Eby G. Friedman
      Pages 255-255
  5. Power Delivery Circuits

    1. Front Matter
      Pages 257-258

About this book

Introduction

This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power delivery and management systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems.   Organized into subareas to provide a more intuitive flow to the reader, this fourth edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.

Keywords

Circuits and Systems Multi-layer Power Grid Networks Nanoscale Integrated Circuits On-Chip Decoupling Capacitors On-Chip Power Delivery and Management On-Chip Power Distribution Networks

Authors and affiliations

  • Inna P. Vaisband
    • 1
  • Renatas Jakushokas
    • 2
  • Mikhail Popovich
    • 3
  • Andrey V. Mezhiba
    • 4
  • Selçuk Köse
    • 5
  • Eby G. Friedman
    • 6
  1. 1.University of RochesterRochesterUSA
  2. 2.Qualcomm CorporationSan DiegoUSA
  3. 3.Qualcomm CorporationSan MarcosUSA
  4. 4.Intel CorporationHillsboroUSA
  5. 5.University of South FloridaTampaUSA
  6. 6.University of RochesterRochesterUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-319-29395-0
  • Copyright Information Springer International Publishing Switzerland 2016
  • Publisher Name Springer, Cham
  • eBook Packages Engineering
  • Print ISBN 978-3-319-29393-6
  • Online ISBN 978-3-319-29395-0
  • About this book