IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip

VLSI-SoC: Internet of Things Foundations

22nd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2014, Playa del Carmen, Mexico, October 6-8, 2014, Revised Selected Papers

  • Luc Claesen
  • Maria-Teresa Sanz-Pascual
  • Ricardo Reis
  • Arturo Sarmiento-Reyes

Part of the IFIP Advances in Information and Communication Technology book series (IFIPAICT, volume 464)

Table of contents

  1. Front Matter
    Pages I-XIV
  2. Liang Wang, Xiaohang Wang, Terrence Mak
    Pages 1-20
  3. Sreenivaas S. Muthyala, Nur A. Touba
    Pages 21-38
  4. Jinwook Jung, Dongsoo Lee, Youngsoo Shin
    Pages 39-57
  5. Farshad Moradi, Mohammad Tohidi, Behzad Zeinali, Jens K. Madsen
    Pages 95-109
  6. Alessandro Lonardi, Graziano Pravadelli
    Pages 110-128
  7. Matthieu Dubois, Haralampos-G. Stratigopoulos, Salvador Mir, Manuel J. Barragan
    Pages 129-148
  8. Dominik Auras, Uwe Deidersen, Rainer Leupers, Gerd Ascheid
    Pages 149-169
  9. Kerem Seyid, Ömer Çogal, Vladan Popovic, Hossein Afshari, Alexandre Schmid, Yusuf Leblebici
    Pages 170-197
  10. Thomas Marconi, Christian Spagnol, Emanuel Popovici, Sorin Cotofana
    Pages 198-219
  11. Vincent Beroulle, Philippe Candelier, Stephan De Castro, Giorgio Di Natale, Jean-Max Dutertre, Marie-Lise Flottes et al.
    Pages 220-240
  12. Back Matter
    Pages 241-241

About these proceedings

Introduction

This book contains extended and revised versions of the best papers presented at the 22nd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2014, held in Playa del Carmen, Mexico, in October 2014. The 12 papers included in the book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of these systems.

Keywords

3D integration Analog and mixed signal design Communication Computer architecture Computer hardware Computer-aided design (CAD) Digital signal processing Electronic Design Automation (EDA) Logic design Low-power Microelectromechanical systems (MEMS) Microelectronics design Microprocessor chips Simulation Software co-design Synthesis System-on-chip Verification Very Large Scale Integration VLSI circuits

Editors and affiliations

  • Luc Claesen
    • 1
  • Maria-Teresa Sanz-Pascual
    • 2
  • Ricardo Reis
    • 3
  • Arturo Sarmiento-Reyes
    • 4
  1. 1.Hasselt UniversityDiepenbeekBelgium
  2. 2.Electronics DepartmentINAOETonantzintlaMexico
  3. 3.Federal University of Rio Grande do SulPorto AlegreBrazil
  4. 4.Electronics DepartmentINAOETonantzintlaMexico

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-319-25279-7
  • Copyright Information IFIP International Federation for Information Processing 2015
  • Publisher Name Springer, Cham
  • eBook Packages Computer Science
  • Print ISBN 978-3-319-25278-0
  • Online ISBN 978-3-319-25279-7
  • Series Print ISSN 1868-4238
  • Series Online ISSN 1868-422X
  • About this book