Editors:
- Discusses multiscale modeling of materials at the mesoscale
- Highlights current state-of-the-art, novel research topics and achievements in the area of molecular modelling and multiscaling problems of electronic materials and their applications as well as atomistic modeling of mechanical properties
- Provides practical examples for engineers interested in molecular modeling using simulations drawn from electronic packaging, dielectric materials, and thermal and mechanical properties
- Includes supplementary material: sn.pub/extras
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Table of contents (9 chapters)
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Front Matter
About this book
Editors and Affiliations
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Microsystem Electronics and Photonics, Wroclaw University of Technology, Wroclaw, Poland
Artur Wymyslowski
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Honeywell Specialty Materials, Sunnyvale California, USA
Nancy Iwamoto
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Department of Mechanical Engineering, Hong Kong University of Science and Technology, Kowloon, Hong Kong SAR
Matthew Yuen, Haibo Fan
Bibliographic Information
Book Title: Molecular Modeling and Multiscaling Issues for Electronic Material Applications
Book Subtitle: Volume 2
Editors: Artur Wymyslowski, Nancy Iwamoto, Matthew Yuen, Haibo Fan
DOI: https://doi.org/10.1007/978-3-319-12862-7
Publisher: Springer Cham
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer International Publishing Switzerland 2015
Hardcover ISBN: 978-3-319-12861-0Published: 03 December 2014
Softcover ISBN: 978-3-319-36666-1Published: 10 September 2016
eBook ISBN: 978-3-319-12862-7Published: 20 November 2014
Edition Number: 1
Number of Pages: X, 194
Number of Illustrations: 76 b/w illustrations, 77 illustrations in colour
Topics: Electronics and Microelectronics, Instrumentation, Solid Mechanics, Optical and Electronic Materials, Nanoscale Science and Technology