Overview
- Discusses implications of problems associated with large-area electronics and compares them to standard silicon
- Provides the basis for understanding physics and modeling of disordered material
- Includes guidelines to quickly setup the basic CAD tools enabling efficient and reliable designs
- Illustrates practical solutions to cope with hard/soft faults, variability, mismatch, aging and bias stress at architecture, circuit, layout, and device levels
- Includes supplementary material: sn.pub/extras
Part of the book series: Analog Circuits and Signal Processing (ACSP)
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About this book
This book illustrates a variety of circuit designs on plastic foils and provides all the information needed to undertake successful designs in large-area electronics. The authors demonstrate architectural, circuit, layout, and device solutions and explain the reasons and the creative process behind each. Readers will learn how to keep under control large-area technologies and achieve robust, reliable circuit designs that can face the challenges imposed by low-cost low-temperature high-throughput manufacturing.
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Keywords
Table of contents (9 chapters)
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Front Matter
Authors and Affiliations
Bibliographic Information
Book Title: Circuit Design on Plastic Foils
Authors: Daniele Raiteri, Eugenio Cantatore, Arthur H.M. van Roermund
Series Title: Analog Circuits and Signal Processing
DOI: https://doi.org/10.1007/978-3-319-11427-9
Publisher: Springer Cham
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer International Publishing Switzerland 2015
Hardcover ISBN: 978-3-319-11426-2Published: 15 December 2014
Softcover ISBN: 978-3-319-36459-9Published: 23 August 2016
eBook ISBN: 978-3-319-11427-9Published: 03 December 2014
Series ISSN: 1872-082X
Series E-ISSN: 2197-1854
Edition Number: 1
Number of Pages: X, 130
Number of Illustrations: 50 b/w illustrations, 53 illustrations in colour
Topics: Circuits and Systems, Electronic Circuits and Devices, Electronics and Microelectronics, Instrumentation