Overview
- Presents in-depth analysis of specific aspects of mechanical behavior
- Shows the environmental impact on semiconductor mechanical properties
- Suggests alternate production methods for semiconductors to preserve life on earth
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Keywords
- Environmental Effect
- Major Semiconductor Components
- Mechanical Properties
- fatigue
- creep
- deformation
About this book
This book provides a comprehensive overview of the impact of environmental constituents on the mechanical properties of semiconductors. Chapter 1 sets the stage by outlining the various environmental constituents that can have deleterious effects on both the mechanical properties of materials and the health of those who handle them. This includes gases such as oxygen, nitrogen, hydrogen, air, and moisture in the air, some of which are responsible for greenhouse gas emissions that directly affect the climate. Chapters 2 through 12 delve into specific aspects of mechanical behavior, including elastic properties, plastic deformation, defects, hardness, brittle behavior, impact testing, deformation processes, and time-dependent deformation. The book also examines how the behavior of semiconductors differs at the nano scale and provides insights into improving their mechanical properties.
This book is a valuable resource for researchers, engineers, and students inthe fields of materials science and engineering, semiconductor technology, and nanotechnology. It highlights the urgent need to assess the global environmental impacts of these materials and suggests alternate uses for their production in order to preserve life on earth.
Authors and Affiliations
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Bibliographic Information
Book Title: The Influence of Environment on Mechanical Characteristics of Key Semiconductor Components
Authors: Joshua Pelleg
Publisher: Springer Cham
eBook Packages: Chemistry and Materials Science, Chemistry and Material Science (R0)
Copyright Information: The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Switzerland AG 2024
Hardcover ISBN: 978-3-031-34529-6Due: 10 November 2024
Softcover ISBN: 978-3-031-34532-6Due: 10 November 2024
eBook ISBN: 978-3-031-34530-2Due: 10 November 2024
Edition Number: 1