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A Guide to Lead-free Solders

Physical Metallurgy and Reliability

  • Book
  • © 2007

Overview

Authors:
  1. John W. Evans

    1. Silver Spring, USA

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    You can also search for this author in PubMed   Google Scholar

Editors:
  1. Werner Engelmaier

    1. Ormond Beach, USA

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    You can also search for this editor in PubMed   Google Scholar

  • Covers all aspects of lead-free solders from physical properties to product assurance
  • The reader will be able to choose new solders more suitable to the climate of legislation and public opinion based on a comparison of their strengths and weaknesses and with the properties of the lead-based solders currently in use
  • The theoretical basis of the book will allow solder producers to make solders with more desirable properties in the future
  • Includes supplementary material: sn.pub/extras

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Table of contents (8 chapters)

  1. Front Matter

    Pages i-xiv
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  2. Introduction to Solder Alloys and Their Properties

    Pages 1-27

  3. Packaging Architecture and Assembly Technology

    • Dongil Kwon
    Pages 29-51

  4. Wetting and Joint Formation

    Pages 53-78

  5. Microstructural Instability in Solders

    Pages 79-95

  6. Intermetallic Formation and Growth

    • Dongil Kwon
    Pages 97-126

  7. Mechanical Properties and Creep Behavior

    Pages 127-143

  8. Thermomechanical Fatigue

    Pages 145-185

  9. Product Assurance

    • Jillian Y. Evans
    Pages 187-202

  10. Back Matter

    Pages 203-206
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Keywords

About this book

The transition to lead-free solders seems to be a foregone conclusion with Japan and Europe leading the way. Indeed some key companies will move to lead free soon and the WEEE Directive 2002/96/EC on Waste Electrical and Electronic Equipment will require all companies doing business in the EU to transition to lead-free. Compliance with forthcoming lead-free regulations will ultimately fall to individual companies and the engineers responsible for design and prod- tion of electronic products and they must be prepared with adequate knowledge of the materials that are leading candidates and they must be prepared to fill the gaps in the data base for their own products. Research worldwide over the past 10 years has produced data and direction for choosing an alloy to substitute for near-eutectic SnPb alloys. This book will provide a valuable resource for engineers involved in the transition to products. Basic theory is presented on the physical metallurgy of soldering technology including elements of assembly, surface finishes and solder-paste technology, wetting and solidification, microstructural instability and intermetallic c- pounds and mechanical, creep and fatigue behavior. Techniques for measuring and testing are discussed and data on SnPb and various lead-free solders are presented and compared. If lead-free solder data are not available on the re- vant topic, information is presented on near-eutectic SnPb, so as to show where the gaps in knowledge need to be filled.

Authors, Editors and Affiliations

  • Ormond Beach, USA

    Werner Engelmaier

  • Silver Spring, USA

    John W. Evans

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