Benefiting from Thermal and Mechanical Simulation in Micro-Electronics

  • G. Q. Zhang
  • L. J. Ernst
  • O. de Saint Leger

Table of contents

  1. Front Matter
    Pages i-x
  2. Bernd Schwarz, Hans Jürgen Albrecht, Gunnar Petzold, Jörg Deliga, Christian Wegener
    Pages 1-16
  3. O. F. Slattery, G. Kelly, J. Greer
    Pages 17-26
  4. Steffen Wiese, Frank Feustel, Ekkehard Meusel
    Pages 27-36
  5. S. H. Pulko
    Pages 59-73
  6. Rainer Dudek, Jürgen Auersperg, Bernd Michel
    Pages 93-111
  7. Dietmar Vogel, Jian Chen, Ingrid De Wolf
    Pages 113-133
  8. M. A. Crisfield, A. J. Burton
    Pages 135-149
  9. Bart Vandevelde, Eric Beyne
    Pages 165-177
  10. Dick den Hertog, Peter Stehouwer
    Pages 179-192

About this book

Introduction

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development.
Main areas covered are:-
  • The impact of simulation on industry profitability
  • Approaches to simulation
  • The state-of-the-art methodologies of simulation
  • Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.
  • Keywords

    development electronics fatigue finite element method material modeling polymer pressure simulation software vapor vapor pressure

    Editors and affiliations

    • G. Q. Zhang
      • 1
    • L. J. Ernst
      • 2
    • O. de Saint Leger
      • 3
    1. 1.Philips CFTEindhovenThe Netherlands
    2. 2.Delft University of TechnologyDelftThe Netherlands
    3. 3.COMPETE Network Co-ordinator at MTAParisFrance

    Bibliographic information

    • DOI https://doi.org/10.1007/978-1-4757-3159-0
    • Copyright Information Springer-Verlag US 2000
    • Publisher Name Springer, Boston, MA
    • eBook Packages Springer Book Archive
    • Print ISBN 978-1-4419-4873-1
    • Online ISBN 978-1-4757-3159-0
    • About this book