Thermal Conductivity 16

  • David C. Larsen

Table of contents

  1. Front Matter
    Pages i-xx
  2. Theory, Solids at Low Temperature — I

  3. Geologic Materials — I

  4. Theory, Solids at Low Temperature — II

    1. Front Matter
      Pages 131-131
    2. C. L. Tsai, A. R. Moodenbaugh, H. Weinstock, Y. Chen
      Pages 139-154
    3. F. J. Pinski, W. H. Butler, P. B. Allen
      Pages 155-163
  5. Geologic Materials — II

    1. Front Matter
      Pages 179-179

About this book


The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. C. F. Lucks and grew out of the needs of researchers in the field. From 1961 to 1973 the Confer­ ences were held annually, and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the permanent Spon­ sor of the Conferences. These Conferences provide a broadly based forum for researchers actively working on the thermal conductivity and closely related properties to convene on a regular basis to ex­ change their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible, artificial barriers between disciplines and gather togeth­ er in increasing numbers without the need of national publicity and continuing funding support, when they see something worthwi1e going on. It is believed that this series of Conferences not only will grow stronger, but will set an example for researchers in other fields on how to jointly attack their own problem areas.


ceramics composite material data analysis deformation glass information iron metals polymer porous media research ultrasound

Editors and affiliations

  • David C. Larsen
    • 1
  1. 1.IIT Research InstituteChicagoUSA

Bibliographic information

  • DOI
  • Copyright Information Springer-Verlag US 1983
  • Publisher Name Springer, Boston, MA
  • eBook Packages Springer Book Archive
  • Print ISBN 978-1-4684-4267-0
  • Online ISBN 978-1-4684-4265-6
  • About this book