Failure Modes and Mechanisms in Electronic Packages

  • Puligandla Viswanadham
  • Pratap Singh

Table of contents

  1. Front Matter
    Pages i-xx
  2. Puligandla Viswanadham, Pratap Singh
    Pages 1-11
  3. Puligandla Viswanadham, Pratap Singh
    Pages 12-50
  4. Puligandla Viswanadham, Pratap Singh
    Pages 51-69
  5. Puligandla Viswanadham, Pratap Singh
    Pages 70-95
  6. Puligandla Viswanadham, Pratap Singh
    Pages 96-135
  7. Puligandla Viswanadham, Pratap Singh
    Pages 136-282
  8. Puligandla Viswanadham, Pratap Singh
    Pages 283-309
  9. Puligandla Viswanadham, Pratap Singh
    Pages 310-326
  10. Back Matter
    Pages 327-370

About this book


Those of us who grew up in the "through-hole" age of electronic packaging are probably more amazed and appreciative than are our children at the incredible growth of electronic performance capability. My son, an electrical engineering student, seems almost to take for granted the innovations that leave me somewhat awestruck at times. Electronic circuit designers delight in packing more punch into less volume, while reminding us that their job has become increasingly challenging. The lay person also has learned from the media that the industry has been working wonders in shrinking the transistor and expanding the power of "the chip. " Much attention is focussed on the silicon and on the marvelous production and entertainment tools we now see in our offices and homes. Between the silicon and the end product lies the less publicized world of circuit-level packaging. We leave it to a cadre of technologists to take the schematics and parts lists and to develop the processes that tum the designers' concepts into physical reality. And while the silicon transistor is shrinking, the engineering challenges of packaging multiple chips and associated components into increasingly dense subsystems are growing. Further, the transistor may have to function without failure through severe industrial or military environments over the lifetime of the product.


assembly circuit concurrent engineering design electronics glass glass fiber interconnect laser manufacturing material modeling reliability semiconductor simulation

Authors and affiliations

  • Puligandla Viswanadham
    • 1
  • Pratap Singh
    • 2
  1. 1.Technology Development GroupCircuit Card Assembly Raytheon TI Sytems Inc.LewisvilleUSA
  2. 2.RAMP LabsRound RockUSA

Bibliographic information

  • DOI
  • Copyright Information Chapman & Hall 1998
  • Publisher Name Springer, Boston, MA
  • eBook Packages Springer Book Archive
  • Print ISBN 978-1-4613-7763-4
  • Online ISBN 978-1-4615-6029-6
  • About this book