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Failure Analysis of Integrated Circuits

Tools and Techniques

  • Lawrence C. Wagner

Table of contents

  1. Front Matter
    Pages i-xiii
  2. Lawrence C. Wagner
    Pages 1-11
  3. Steven Frank, Wilson Tan, John F. West
    Pages 13-41
  4. Thomas M. Moore, Cheryl D. Hartfield
    Pages 43-57
  5. Phuc D. Ngo
    Pages 59-66
  6. Christopher G. Talbot
    Pages 113-143
  7. Daniel Yim
    Pages 145-157
  8. Tim Haddock, Scott Boddicker
    Pages 159-173
  9. Lawrence C. Wagner
    Pages 175-193
  10. Lawrence C. Wagner
    Pages 195-203
  11. Phuc D. Ngo
    Pages 205-215
  12. Robert K. Lowry
    Pages 217-227
  13. Keenan Evans
    Pages 229-240
  14. David P. Vallett
    Pages 241-250
  15. Back Matter
    Pages 251-255

About this book

Introduction

Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique.
Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.

Keywords

circuit diagnosis energy integrated circuit semiconductor

Editors and affiliations

  • Lawrence C. Wagner
    • 1
  1. 1.Texas Instruments IncorporatedUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4615-4919-2
  • Copyright Information Kluwer Academic Publishers 1999
  • Publisher Name Springer, Boston, MA
  • eBook Packages Springer Book Archive
  • Print ISBN 978-1-4613-7231-8
  • Online ISBN 978-1-4615-4919-2
  • Series Print ISSN 0893-3405
  • Buy this book on publisher's site