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  • Book
  • © 1993

Multichip Module Technologies and Alternatives: The Basics

Editors:

  1. Daryl Ann Doane
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  2. Paul D. Franzon
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Table of contents (18 chapters)

  1. Front Matter

    Pages i-xxxii
    PDF

  2. The Framework

    1. Front Matter

      Pages 1-2
      PDF

    2. Introduction

      • Daryl Ann Doane
      Pages 3-36

    3. MCM Package Selection: A Materials and Manufacturing Perspective

      • Allison Casey Dixon, Edward G. Myszka
      Pages 37-86

    5. MCM Package Selection: Cost Issues

      • Lee Hong Ng
      Pages 133-164

  3. The Basics

    1. Front Matter

      Pages 165-167
      PDF

    2. Laminate-Based Technologies for Multichip Modules

      • Leo M. Higgins III
      Pages 169-213

    5. Selection Criteria for Multichip Module Dielectrics

      • Claudius Feger, Christine Feger
      Pages 311-348

    6. Chip-To-Substrate (First Level) Connection Technology Options

      • Robert E. Rackerby, Erik N. Larson, Dean R. Haagenson, Steve J. Bezuk, Rajendra D. Pendse, Chee C. Wong et al.
      Pages 349-486

    8. Electrical Design of Digital Multichip Modules

      • Paul D. Franzon
      Pages 525-568

    10. Electrical Testing of Multichip Modules

      • Thomas C. Russell, Yenting Wen
      Pages 615-660

  4. Case Studies

    1. Front Matter

      Pages 661-663
      PDF

    2. The Development of Unisys Multichip Modules

      • John A. Nelson, Randy D. Rhodes
      Pages 665-694

    3. High Performance Aerospace Multichip Module Technology Development at Hughes

      • Robert L. Bone, Dennis F. Elwell, James J. Licari, Robert S. Miles, Kevin P. Shambrook, Stanley M. Stuhlbarg et al.
      Pages 695-735

    4. Silicon-Based Multichip Modules

      • R. Wayne Johnson
      Pages 737-768
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About this book

Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.
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Buy it now

eBook USD 169.00
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Hardcover Book USD 219.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Other ways to access

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