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Foldable Flex and Thinned Silicon Multichip Packaging Technology

  • Editors
  • John W. Balde

Part of the Emerging Technology in Advanced Packaging Series book series (ADEP, volume 1)

Table of contents

  1. Front Matter
    Pages i-xix
  2. Christine Kallmayer
    Pages 49-67
  3. Karlheinz Bock, Michael Feil, Christof Landesberger
    Pages 101-148
  4. Joerg-Uwe Meyer, Martin Schuettler, Oliver Scholz, Werner Haberer, Thomas Stieglitz
    Pages 149-176
  5. Mike Warner, William Carlson
    Pages 177-216
  6. Georges Rochat, Philippe Clot, Jean-François Zeberli
    Pages 217-234
  7. E. Jan Vardaman, Dominique Numakura
    Pages 247-255
  8. Leonard W. Schaper
    Pages 289-309
  9. John W. Balde
    Pages 327-328
  10. Back Matter
    Pages 329-347

About this book

Introduction

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

Keywords

circuit design development electronics interconnect material microprocessor power systems processor production system on chip (SoC)

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4615-0231-9
  • Copyright Information Kluwer Academic Publishers 2003
  • Publisher Name Springer, Boston, MA
  • eBook Packages Springer Book Archive
  • Print ISBN 978-0-7923-7676-7
  • Online ISBN 978-1-4615-0231-9
  • Series Print ISSN 1572-087X
  • Buy this book on publisher's site