Skip to main content
SpringerLink
Log in
Book cover

Advanced Thermal Management Materials

  • Book
  • © 2013

Overview

Authors:
  1. Guosheng Jiang

    1. , College of Materials Science and Eng., Central South University, Changsha, China, People's Republic

    View author publications

    You can also search for this author in PubMed   Google Scholar

  2. Liyong Diao

    1. Brewer Science, Springfield, USA

    View author publications

    You can also search for this author in PubMed   Google Scholar

  3. Ken Kuang

    1. Torrey Hills Technologies, LLC, San Diego, USA

    View author publications

    You can also search for this author in PubMed   Google Scholar

  • Provides an in-depth overview of copper, metal and aluminum materials and discusses the advantages and disadvantages of each in thermal management
  • Discusses numerical simulation methods and techniques used in analysis of electronic devices and materials
  • Covers system and component integration of advanced packaging materials
  • Includes supplementary material: sn.pub/extras

This is a preview of subscription content, log in via an institution to check access.

Access this book

Log in via an institution
eBook USD 84.99
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book USD 109.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book USD 109.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Other ways to access

Licence this eBook for your library

Institutional subscriptions

Table of contents (10 chapters)

  1. Front Matter

    Pages i-xi
    Download chapter PDF

  2. Introduction to Thermal Management in Microelectronics Packaging

    • Guosheng Jiang, Liyong Diao, Ken Kuang
    Pages 1-10

  3. Requirements of Thermal Management Materials

    • Guosheng Jiang, Liyong Diao, Ken Kuang
    Pages 11-28

  4. Overview of Traditional Thermal Management Materials

    • Guosheng Jiang, Liyong Diao, Ken Kuang
    Pages 29-44

  5. Development of Advanced Thermal Management Materials

    • Guosheng Jiang, Liyong Diao, Ken Kuang
    Pages 45-71

  6. Properties of WCu, MoCu, and Cu/MoCu/Cu High-performance Heat Sink Materials and Manufacturing Technologies

    • Guosheng Jiang, Liyong Diao, Ken Kuang
    Pages 73-87

  7. Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications

    • Guosheng Jiang, Liyong Diao, Ken Kuang
    Pages 89-98

  8. Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications

    • Guosheng Jiang, Liyong Diao, Ken Kuang
    Pages 99-107

  9. AlSiC Thermal Management Materials

    • Guosheng Jiang, Liyong Diao, Ken Kuang
    Pages 109-122

  10. Understanding Lasers, Laser Diodes, Laser Diode Packaging and Their Relationship to Tungsten Copper

    • Guosheng Jiang, Liyong Diao, Ken Kuang
    Pages 123-140

  11. Future Trend of Advanced Thermal Management Materials

    • Guosheng Jiang, Liyong Diao, Ken Kuang
    Pages 141-149

  12. Back Matter

    Pages 151-154
    Download chapter PDF
Back to top

Keywords

About this book

Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions.

Authors and Affiliations

  • , College of Materials Science and Eng., Central South University, Changsha, China, People's Republic

    Guosheng Jiang

  • Brewer Science, Springfield, USA

    Liyong Diao

  • Torrey Hills Technologies, LLC, San Diego, USA

    Ken Kuang

Bibliographic Information

Publish with us

Policies and ethics

Back to top

Search

Navigation