Low Power Interconnect Design

  • Sandeep Saini

Table of contents

  1. Front Matter
    Pages i-xvii
  2. Basics of Interconnect Design

    1. Front Matter
      Pages 1-1
    2. Sandeep Saini
      Pages 3-31
    3. Sandeep Saini
      Pages 33-54
  3. Buffer and Schmidt Trigger Insertion Techniques for Low Power Interconnect Design

    1. Front Matter
      Pages 55-55
    2. Sandeep Saini
      Pages 75-112
  4. Bus Coding Techniques for Low Power Interconnect Design

    1. Front Matter
      Pages 113-113
    2. Sandeep Saini
      Pages 115-152

About this book

Introduction

This book provides practical solutions for delay and power reduction for on-chip interconnects and buses.  It provides an in depth description of the problem of signal delay and extra power consumption, possible solutions for delay and glitch removal, while considering the power reduction of the total system.  Coverage focuses on use of the Schmitt Trigger as an alternative approach to buffer insertion for delay and power reduction in VLSI interconnects. In the last section of the book, various bus coding techniques are discussed to minimize delay and power in address and data buses.

 

·         Provides practical solutions for delay and power reduction for on-chip interconnects and buses;

·         Focuses on Deep Sub micron technology devices and interconnects;

·         Offers in depth analysis of delay, including details regarding crosstalk and parasitics; 

·         Describes use of the Schmitt Trigger as a versatile alternative approach to buffer insertion for delay and power reduction in VLSI interconnects;

·         Provides detailed simulation results to support the theoretical discussions.

·         Provides details of delay and power efficient bus coding techniques.

Keywords

Embedded Systems Integrated Circuit Design Interconnect Buffer Insertion Network on Chip On-chip interconnect Schmitt Trigger

Authors and affiliations

  • Sandeep Saini
    • 1
  1. 1.The LNM Institute of Information TechnolJaipurIndia

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4614-1323-3
  • Copyright Information Springer Science+Business Media New York 2015
  • Publisher Name Springer, New York, NY
  • eBook Packages Engineering
  • Print ISBN 978-1-4614-1322-6
  • Online ISBN 978-1-4614-1323-3
  • About this book