High-Speed Optical Receivers with Integrated Photodiode in Nanoscale CMOS

  • Filip Tavernier
  • Michiel Steyaert

Part of the Analog Circuits and Signal Processing book series (ACSP, volume 5)

Table of contents

  1. Front Matter
    Pages 1-1
  2. Filip Tavernier, Michiel Steyaert
    Pages 1-14
  3. Filip Tavernier, Michiel Steyaert
    Pages 15-39
  4. Filip Tavernier, Michiel Steyaert
    Pages 41-76
  5. Filip Tavernier, Michiel Steyaert
    Pages 77-135
  6. Filip Tavernier, Michiel Steyaert
    Pages 137-152
  7. Filip Tavernier, Michiel Steyaert
    Pages 153-183
  8. Filip Tavernier, Michiel Steyaert
    Pages 185-212
  9. Filip Tavernier, Michiel Steyaert
    Pages 213-214
  10. Back Matter
    Pages 216-216

About this book

Introduction

This book describes the design of optical receivers that use the most economical integration technology, while enabling performance that is typically only found in very expensive devices.  To achieve this, all necessary functionality, from light detection to digital output, is integrated on a single piece of silicon. All building blocks are thoroughly discussed, including photodiodes, transimpedance amplifiers, equalizers and post amplifiers.

  • Provides a thorough explanation of all relevant aspects of receivers and optical receivers; 
  •  Describes all key building blocks of an optical receiver and their design trade-offs;
  • Introduces new design solutions for every building block in order to improve its performance;
  •  Illustrates all techniques and formulas with extensive examples and figures;
  •  Includes several real, state-of-the-art chip implementations

 
 
 


 

Keywords

Analog Circuits and Signal Processing Equalizers Integrated Photodiodes Nanoscale CMOS Optical Communication Optical Receivers Opto-Electrical Receivers Post Amplifiers Transimpedance amplifiers

Authors and affiliations

  • Filip Tavernier
    • 1
  • Michiel Steyaert
    • 2
  1. 1.K.U.LeuvenLeuvenBelgium
  2. 2.Departement Elektrotechniek, ESAT-MICASK.U. LeuvenHeverleeBelgium

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4419-9925-2
  • Copyright Information Springer Science+Business Media, LLC 2011
  • Publisher Name Springer, New York, NY
  • eBook Packages Engineering
  • Print ISBN 978-1-4419-9924-5
  • Online ISBN 978-1-4419-9925-2
  • About this book