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High-/Mixed-Voltage Analog and RF Circuit Techniques for Nanoscale CMOS

  • Pui-In Mak
  • Rui Paulo Martins

Part of the Analog Circuits and Signal Processing book series (ACSP)

Table of contents

  1. Front Matter
    Pages i-xvii
  2. Pui-In Mak, Rui Paulo Martins
    Pages 1-8
  3. Pui-In Mak, Rui Paulo Martins
    Pages 55-79
  4. Pui-In Mak, Rui Paulo Martins
    Pages 121-123
  5. Back Matter
    Pages 125-145

About this book

Introduction

This book presents high-/mixed-voltage analog and radio frequency (RF) circuit techniques for developing low-cost multistandard wireless receivers in nm-length CMOS processes.  Key benefits of high-/mixed-voltage RF and analog CMOS circuits are explained, state-of-the-art examples are studied, and circuit solutions before and after voltage-conscious design are compared. Three real design examples are included, which demonstrate the feasibility of high-/mixed-voltage circuit techniques.  

  •  Provides a valuable summary and real case studies of the state-of-the-art in high-/mixed-voltage circuits and systems;
  • Includes novel high-/mixed-voltage analog and RF circuit techniques – from concept to practice;
  • Describes the first high-voltage-enabled mobile-TVRF front-end in 90nm CMOS and the first mixed-voltage full-band mobile-TV Receiver in 65nm CMOS;
  • Demonstrates the feasibility of high-/mixed-voltage circuit techniques with real design examples.

 

Keywords

Analog CMOS Circuits Analog Circuits and Signal Processing High‐/Mixed‐Voltage RF Circuits Mobile-TV RF Multistandard Wireless Receivers Nanoscale CMOS technologies RF Circuits Software Defined Radio TV-GSM Interoperability Wireless Communications

Authors and affiliations

  • Pui-In Mak
    • 1
  • Rui Paulo Martins
    • 2
  1. 1.University of MacauTaipaChina, People's Republic
  2. 2.University of MacauTaipaChina, People's Republic

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4419-9539-1
  • Copyright Information Springer Science+Business Media New York 2012
  • Publisher Name Springer, New York, NY
  • eBook Packages Engineering
  • Print ISBN 978-1-4419-9538-4
  • Online ISBN 978-1-4419-9539-1
  • Buy this book on publisher's site