Overview
- Provides a comprehensive guide to designing the most effective and lowest-cost microelectronic test structures
- Uses specific examples of good design techniques and discusses common errors to avoid in order to guide readers
- Presents an integrated approach to multiple parts of the design process, using measurement techniques and statistical analysis combined with physical mapping
- Includes supplementary material: sn.pub/extras
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Table of contents (10 chapters)
Keywords
- Bhushan
- CMOS
- CMOS Process
- CMOS technology
- Circuit design
- Ketchen
- Manjul Bhushan
- Manufacturability
- Mark B. Ketchen
- Microelectronics
- Microelectronics test structures
- Silicon chip design
- Silicon chip manufacturing
- Silicon fabrication
- Silicon manufacturing
- Test processes
- Test structures
- VLSI circuit design
About this book
Microelectronic Test Structures for CMOS Technology and Products addresses the basic concepts of the design of test structures for incorporation within test-vehicles, scribe-lines, and CMOS products. The role of test structures in the development and monitoring of CMOS technologies and products has become ever more important with the increased cost and complexity of development and manufacturing. In this timely volume, IBM scientists Manjul Bhushan and Mark Ketchen emphasize high speed characterization techniques for digital CMOS circuit applications and bridging between circuit performance and characteristics of MOSFETs and other circuit elements.  Detailed examples are presented throughout, many of which are equally applicable to other microelectronic technologies as well. The authors’ overarching goal is to provide students and technology practitioners alike a practical guide to the disciplined design and use of test structures that give unambiguous information on the parametrics and performance of digital CMOS technology.
Authors and Affiliations
Bibliographic Information
Book Title: Microelectronic Test Structures for CMOS Technology
Authors: Manjul Bhushan, Mark B. Ketchen
DOI: https://doi.org/10.1007/978-1-4419-9377-9
Publisher: Springer New York, NY
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer Science+Business Media, LLC 2011
Hardcover ISBN: 978-1-4419-9376-2
Softcover ISBN: 978-1-4899-9055-6
eBook ISBN: 978-1-4419-9377-9
Edition Number: 1
Number of Pages: XXXIV, 373
Topics: Electronics and Microelectronics, Instrumentation, Optical and Electronic Materials, Circuits and Systems