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Thin-Film Capacitors for Packaged Electronics

  • Pushkar Jain
  • Eugene J. Rymaszewski

Table of contents

  1. Front Matter
    Pages i-xv
  2. Pushkar Jain, Eugene J. Rymaszewski
    Pages 1-25
  3. Pushkar Jain, Eugene J. Rymaszewski
    Pages 27-41
  4. Pushkar Jain, Eugene J. Rymaszewski
    Pages 43-89
  5. Pushkar Jain, Eugene J. Rymaszewski
    Pages 91-119
  6. Pushkar Jain, Eugene J. Rymaszewski
    Pages 121-143
  7. Pushkar Jain, Eugene J. Rymaszewski
    Pages 145-153
  8. Back Matter
    Pages 155-158

About this book

Introduction

Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to limits of what's the best one can achieve in capacitor properties to process modeling to application examples. Some of the topics covered are the following:
-Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structures,
-Electrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz),
-Process modeling to determine stable operating points,
-Prevention of metal (Cu) diffusion into the dielectric,
-Measurements and modeling of the dielectric micro-roughness.

Keywords

adhesion circuit design dielectrics electronics interconnect magnetism material metals modeling power distribution power electronics signal thin films transmission

Authors and affiliations

  • Pushkar Jain
    • 1
  • Eugene J. Rymaszewski
    • 1
  1. 1.Rensselaer Polytechnic InstituteTroyUSA

Bibliographic information