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Ultra-thin Chip Technology and Applications

  • Joachim Burghartz

Table of contents

  1. Front Matter
    Pages i-xxii
  2. From Thick Wafers to Ultra-Thin Silicon Chips

    1. Front Matter
      Pages 1-1
    2. Peter Stallhofer
      Pages 3-12
    3. Joachim N. Burghartz
      Pages 13-18
  3. Thin Chip Fabrication Technologies

    1. Front Matter
      Pages 19-20
    2. Florian Schmitt, Michael Zernack
      Pages 21-32
    3. Christof Landesberger, Sabine Scherbaum, Karlheinz Bock
      Pages 33-43
    4. Yoshikazu Kobayashi, Martin Plankensteiner, Midoriko Honda
      Pages 45-51
    5. Evangelos A. Angelopoulos, Alexander Kaiser
      Pages 53-60
    6. Martin Zimmermann, Joachim N. Burghartz, Wolfgang Appel, Christine Harendt
      Pages 69-77
  4. Add-on Processing

    1. Front Matter
      Pages 79-80
    2. Franz Laermer, Andrea Urban
      Pages 81-91
    3. Mitsumasa Koyanagi
      Pages 109-123
    4. Christof Landesberger, Sabine Scherbaum, Karlheinz Bock
      Pages 125-138
  5. Assembly and Embedding of Ultra-Thin Chips

    1. Front Matter
      Pages 139-140
    2. Andreas Dietzel, Jeroen van den Brand, Jan Vanfleteren, Wim Christiaens, Erwin Bosman, Johan De Baets
      Pages 141-157
    3. Andreas Kugler, Metin Koyuncu, André Zimmermann, Jan Kostelnik
      Pages 159-165
    4. Fabian Schnegg, Hannes Kostner, Gernot Bock, Stefan Engensteiner
      Pages 167-183
    5. Paresh Limaye, Wenqi Zhang
      Pages 185-192
  6. Characterization and Modelling

    1. Front Matter
      Pages 193-193
    2. Stephan Schoenfelder, Joerg Bagdahn, Mattias Petzold
      Pages 195-218
    3. Tu Hoang, Stefan Endler, Christine Harendt
      Pages 219-232
    4. Nicoleta Wacker, Harald Richter
      Pages 233-243
    5. Mahadi-Ul Hassan, Horst Rempp, Harald Richter, Nicoleta Wacker
      Pages 245-257
    6. Slobodan Mijalković
      Pages 259-270
    7. J. Fredrik Creemer, Patrick J. French
      Pages 271-285
    8. Niccolò Rinaldi, Salvatore Russo, Vincenzo d’Alessandro
      Pages 287-308
    9. Michael Reuter, Sebastian J. Eisele
      Pages 309-318
  7. Applications

    1. Front Matter
      Pages 319-320
    2. Kurt Aigner, Oliver Häberlen, Herbert Hopfgartner, Thomas Laska
      Pages 321-335
    3. Koen De Munck, Kyriaki Minoglou, Piet De Moor
      Pages 337-352
    4. Michael Reuter
      Pages 353-362
    5. Heinz-Gerd Graf
      Pages 363-375
    6. Hannes Sturm, Walter Lang
      Pages 377-387
    7. Cor Scherjon
      Pages 389-398
    8. Thomas Suwald
      Pages 399-411
    9. Ali Asif, Harald Richter
      Pages 413-424
    10. Alvin Joseph, Cheun-Wen Huang, Anthony Stamper, Wayne Woods, Dan Vanslette, Mete Erturk et al.
      Pages 445-453
  8. Back Matter
    Pages 455-467

About this book

Introduction

Ultra-thin Chip Technology and Applications edited by: Joachim N. Burghartz Ultra-thin chip technology has the potential to provide solutions for overcoming bottlenecks in silicon technology and for leading to new applications. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, assembly, characterization, modeling and applications of ultra-thin chips. •Provides a comprehensive overview of the challenges in ultra-thin chip fabrication, post processing, properties and applications by leaders in the field sharing their newest results and ideas; •Compares strengths and weaknesses of three generic fabrication processes for ultra-thin chips; •Describes electronic, mechanical, optical, and thermal properties of ultra-thin chips that are different from those of conventional, thick chips; •Shows that thin chip technology and its applications represents a new paradigm in silicon technology.

Keywords

3D Integrated Circuits ChipFilm Circuit Design Embedded Systems Microelectronics Microsystems Nanomaterials Nanotechnology System in Foil Ultra-thin Chips

Editors and affiliations

  • Joachim Burghartz
    • 1
  1. 1.(IMS CHIPS)Institut für Mikroelektronik StuttgartStuttgartGermany

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4419-7276-7
  • Copyright Information Springer Science+Business Media, LLC 2011
  • Publisher Name Springer, New York, NY
  • eBook Packages Engineering
  • Print ISBN 978-1-4419-7275-0
  • Online ISBN 978-1-4419-7276-7
  • Buy this book on publisher's site