Advertisement

Constrained Deformation of Materials

Devices, Heterogeneous Structures and Thermo-Mechanical Modeling

  • Y.-L.¬†Shen

Table of contents

  1. Front Matter
    Pages i-ix
  2. Y.-L. Shen
    Pages 1-11
  3. Y.-L. Shen
    Pages 13-34
  4. Y.-L. Shen
    Pages 35-76
  5. Y.-L. Shen
    Pages 77-123
  6. Y.-L. Shen
    Pages 125-168
  7. Y.-L. Shen
    Pages 169-262
  8. Y.-L. Shen
    Pages 263-274
  9. Back Matter
    Pages 275-281

About this book

Introduction

"Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-Mechanical Modeling" presents an in-depth look at the mechanical analyses and modeling of advanced small-scale structures and heterogeneous material systems. Mechanical deformations in thin films and miniaturized materials, commonly found in microelectronic devices and packages, MEMS, nanostructures and composite and multi-phase materials, are heavily influenced by the external or internal physical confinement. A continuum mechanics-based approach is used, together with discussions on micro-mechanisms, to treat the subject in a systematic manner under the unified theme. Readers will find valuable information on the proper application of thermo-mechanics in numerical modeling as well as in the interpretation and prediction of physical material behavior, along with many case studies. Additionally, particular attention is paid to practical engineering relevance. Thus real-life reliability issues are discussed in detail to serve the needs of researchers and engineers alike.

Keywords

MEMS STEM composites elastic deformation electronic packaging interfacial science microsystems and devices modeling multi-phase materials thin films

Authors and affiliations

  • Y.-L.¬†Shen
    • 1
  1. 1.Dept. Mechanical EngineeringUniversity of New MexicoAlbuquerqueUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4419-6312-3
  • Copyright Information Springer-Verlag US 2010
  • Publisher Name Springer, Boston, MA
  • eBook Packages Engineering
  • Print ISBN 978-1-4419-6311-6
  • Online ISBN 978-1-4419-6312-3
  • Buy this book on publisher's site