The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects

  • Günter Grossmann
  • Christian Zardini

Table of contents

  1. Front Matter
    Pages i-viii
  2. Günter Grossmann
    Pages 1-18
  3. Rainer Dudek, Ellen Auerswald
    Pages 65-79
  4. C. Zou, C. Hunt
    Pages 81-103
  5. M. J. M. Hermans, M. H. Biglari
    Pages 105-122
  6. Antonello Vicenzo
    Pages 123-159
  7. T. T. Mattila, T. Laurila, V. Vuorinen, J. K. Kivilahti
    Pages 197-225
  8. I. Baylakoglu, E. Hedin
    Pages 275-282
  9. Rainer Dudek
    Pages 297-303
  10. C. Zardini, J.-Y. Deletage
    Pages 305-313

About this book

Introduction

The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in lead-free soldering.

The limited validity of testing methods originating from tin-lead solder was a major point of concern in ELFNET members' discussions. As a result, the network's reliability group decided to bring together the material properties of lead-free solders, as well as the basics of material science, and to discuss their influence on the procedures for accelerated testing. This has led to a matrix of failure mechanisms and their activation and, as a result, to a comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints.

The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is written for scientists, engineers and researchers involved with lead-free electronics.

Keywords

Failure Mechanisms Lead-Free Solder Materials Quality Reliability

Editors and affiliations

  • Günter Grossmann
    • 1
  • Christian Zardini
    • 2
  1. 1.Testing and Research EMPA, Centre for ReliabilitySwiss Federal Laboratories for MaterialsDübendorfSwitzerland
  2. 2.ENSEIRBTalence CedexFrance

Bibliographic information

  • DOI https://doi.org/10.1007/978-0-85729-236-0
  • Copyright Information Springer-Verlag London Limited 2011
  • Publisher Name Springer, London
  • eBook Packages Engineering
  • Print ISBN 978-0-85729-235-3
  • Online ISBN 978-0-85729-236-0
  • About this book