Table of contents

  1. Front Matter
    Pages i-xviii
  2. Carol Handwerker, Ursula Kattner, Kil-Won Moon
    Pages 21-74
  3. Sundar Sethuraman
    Pages 75-90
  4. Christiane Faure, Jasbir Bath
    Pages 91-116
  5. Jasbir Bath
    Pages 117-143
  6. Jean-Paul Clech
    Pages 145-172
  7. Jianbiao Pan, Jasbir Bath, Xiang Zhou, Dennis Willie
    Pages 173-197
  8. Karl Sauter Sr
    Pages 199-220
  9. Hugh Roberts, Kuldip Johal
    Pages 221-269
  10. Jasbir Bath
    Pages 271-284
  11. Back Matter
    Pages 287-299

About this book

Introduction

The push toward lead-free soldering in computers, cell phones and other electronic and electrical devices has taken on a greater urgency as laws have been passed or are pending in the United States, the European Union and Asia which ban lead-bearing solder. These new restrictions on hazardous substances are changing the way electronic devices are assembled, and specifically affect process engineering, manufacturing and quality assurance.

 

Lead-Free Soldering offers in a single volume a broad collection of practical techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources. The book includes the latest information on proposed changes to lead-free standards, and up-to-date analysis of government and legislative activities and regulations in North America, Europe and Asia.

 

Written by recognized experts in both academia and industry, Lead-Free Soldering is a must-have guide for practicing engineers interested in the latest developments surrounding areas such as lead-free alloy properties, reflow, wave, rework , solder joint reliability, PCB laminates and surface finishes, and backward and forward compatibility.

Keywords

Standard electronics process engineering quality assurance reliability

Editors and affiliations

  • JasbirĀ Bath
    • 1
  1. 1.Solectron CorporationMilpitasUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-0-387-68422-2
  • Copyright Information Springer-Verlag US 2007
  • Publisher Name Springer, Boston, MA
  • eBook Packages Engineering
  • Print ISBN 978-0-387-32466-1
  • Online ISBN 978-0-387-68422-2
  • About this book